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浏览/检索结果: 共12条，第1-10条 帮助 限定条件 发表日期：2020    专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302 作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei 收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17 Binary alloys  Brazing  Brazing filler metals  Grain size and shape  Intermetallics  Melting point  Microstructure  Nanoparticles  Synthesis (chemical)  Brazing joints  Composite solders  Crystal planes  Driving forces  Interfacial intermetallics  Liquidus temperature  Melting process  Melting properties   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Effect of post-weld annealing on microstructure and growth behavior of copper/aluminum friction stir welded joint 期刊论文 Materials, 2020, 卷号: 13, 期号: 20, 页码: 1-17 作者:  Jin, Yuhua;  Wu, Bo;  Lu, Xuetian;  Xing, Yichu;  Zhou, Zizheng 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Aluminum  Aluminum alloys  Annealing  Binary alloys  Copper  Copper alloys  Friction  Intermetallics  Microstructure  Research laboratories  Welds  Annealing temperatures  Friction stir welded joints  Growth mechanisms  Interface mi-crostructure  Layered Structures  Original structures  Post-weld annealing  Softening phenomenon   Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：17/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion barriers  Gold  Gold compounds  Heat resistance  Microstructure  Nickel  Open circuit voltage  Soldering  Barrier films  Diffusion barrier films  Electrical resistances  Output current  Reflow--soldering  Solder joints  Temperature differences  Thermoelectric   Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729 作者:  Yu, Weiyuan;  Lei, Zhen;  Sun, Xuemin;  Wu, Baolei;  Sun, Jungang 收藏  |  浏览/下载：6/0  |  提交时间：2020/11/14 Acoustic streaming  Atoms  Cavitation  Copper  Dissolution  Liquids  Solubility  Tin  Ultrasonics  Cavitation bubble  Dissolution behavior  Dissolution rates  Method of finite elements  Saturated solubility  Solid solubilities  Solid-liquid interfaces  Ultrasonic cavitation   Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729 作者:  Yu, Weiyuan;  Lei, Zhen;  Sun, Xuemin;  Wu, Baolei;  Sun, Jungang 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Acoustic streaming  Atoms  Cavitation  Copper  Dissolution  Liquids  Solubility  Tin  Ultrasonics  Cavitation bubble  Dissolution behavior  Dissolution rates  Method of finite elements  Saturated solubility  Solid solubilities  Solid-liquid interfaces  Ultrasonic cavitation   Effect of fifferent filler wires on mechanical property and conductivity of aluminum-copper joints 期刊论文 Materials, 2020, 卷号: 13, 期号: 16 作者:  Zhang, Hengming;  Shi, Yu;  Gu, Yufen;  Li, Chunkai 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14 Aluminum  Binary alloys  Brazing  Copper  Fillers  Gas metal arc welding  Gas welding  Intermetallics  Microhardness  Silicon  Tensile strength  Wire  Aluminum silicons  Aluminum-copper  Aluminum-magnesium  Brazing interface  Double electrodes  Element contents  Intermetallic compound layer  Pure aluminum   Effect of laser texturing on the interface and properties of aluminum/steel arc fusion brazed joints 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 5, 页码: 25-29 作者:  Shi, Yu;  Liang, Qi;  Zhang, Gang;  Li, Guang 收藏  |  浏览/下载：28/0  |  提交时间：2020/11/14 Brazing  Gas welding  Intermetallics  Morphology  Scanning electron microscopy  Tensile strength  Wetting  Intermetallic compound layer  ITS applications  Joint interfaces  Joint performance  Laser texturing  Liquid aluminum  Low power laser  Wetting and spreading   Intermetallic Compound (IMC) Growth at Ni/Sn/Ni Interface Under Ultrasonic Treatment 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 4, 页码: 1402-1408 作者:  Liu, Yun;  Yu, Weiyuan;  Wang, Yanhong;  Sun, Xuemin 收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17 Binary alloys  Cavitation  Dissolution  Grain boundaries  Intermetallics  Tin  Ultrasonic equipment  Acoustic cavitations  Bulk diffusions  Formation and evolutions  Intermetallic compound growths  Intermetallic grains  Power dependence  Ultrasonic cavitation  Ultrasonic treatments