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科研机构
山东大学 [4]
沈阳自动化研究所 [4]
兰州理工大学 [3]
金属研究所 [3]
大连理工大学 [2]
上海药物研究所 [2]
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期刊论文 [20]
会议论文 [3]
发表日期
2019 [23]
学科主题
天文学 [1]
天文学::太阳与太阳... [1]
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Improved Damping and High Strength of Graphene-Coated Nickel Hybrid Foams
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 45, 页码: 42690-42696
作者:
Wang, Han
;
Ma, Chaoqun
;
Zhang, Weimin
;
Cheng, Hui-Ming
;
Zeng, You
收藏
  |  
浏览/下载:125/0
  |  
提交时间:2021/02/02
graphene
nickel foam
hybrid materials
damping properties
mechanical strength
Improved Damping and High Strength of Graphene-Coated Nickel Hybrid Foams
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 45, 页码: 42690-42696
作者:
Wang, Han
;
Ma, Chaoqun
;
Zhang, Weimin
;
Cheng, Hui-Ming
;
Zeng, You
收藏
  |  
浏览/下载:122/0
  |  
提交时间:2021/02/02
graphene
nickel foam
hybrid materials
damping properties
mechanical strength
Multilayered Kelvin-Helmholtz Instability in the Solar Corona
期刊论文
ASTROPHYSICAL JOURNAL LETTERS, 2019, 卷号: 884, 期号: 2, 页码: 5
作者:
Yuan, Ding
;
Shen YD(申远灯)
;
Liu Y(刘煜)
;
Li, Hongbo
;
Feng, Xueshang
收藏
  |  
浏览/下载:45/0
  |  
提交时间:2020/05/18
magnetohydrodynamics (MHD)
Sun: atmosphere
Sun: corona
First-principles investigation of the microscopic mechanism of the physical and chemical mixed adsorption of graphene on metal surfaces
期刊论文
RSC ADVANCES, 2019, 卷号: 9, 期号: 56, 页码: 32712-32720
作者:
Zhang, Xin
;
Wang, Shaoqing
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2021/02/02
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering
期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:
Yu, Weiyuan
;
Liu, Yingzong
;
Liu, Yun
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Binary alloys
Copper compounds
Interface states
Intermetallics
Lead-free solders
Microstructure
Phase interfaces
Soldering
Tin compounds
Ultrasonic effects
Unmanned aerial vehicles (UAV)
Formation and evolutions
Growth patterns
IMC layer
Interfacial intermetallics
Liquid interface
Nonequilibrium state
Ultrasonic vibration
Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system
期刊论文
VACUUM, 2019, 卷号: 167, 页码: 77-89
作者:
Hu, Xiaowu
;
Li, Chao
;
Li, Qinglin
;
Yi, Guangbin
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  |  
浏览/下载:5/0
  |  
提交时间:2019/11/15
SAC305 lead-free solders
Interfacial reaction
Intermetallic compound
Shear strength
Fracture
Underestimated Noncovalent Interactions in Protein Data Bank
期刊论文
JOURNAL OF CHEMICAL INFORMATION AND MODELING, 2019, 卷号: 59, 期号: 8, 页码: 3389-3399
作者:
Xu, Zhijian
;
Zhang, Qian
;
Shi, Jiye
;
Zhu, Weiliang
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2020/07/01
Trained Macrophage Bioreactor for Penetrating Delivery of Fused Antitumor Protein
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 26, 页码: 23018-23025
作者:
Zhang, Yu
;
Zhang, Yujie
;
Guo, Qin
;
Guo, Zhongyuan
;
Chen, Xinli
收藏
  |  
浏览/下载:35/0
  |  
提交时间:2020/07/01
macromolecular protein delivery
cell vector
tumor targeting
intratumoral drug distribution
breast cancer therapy
Formation and evolution of IMCs layer at Cu/Sn solid-liquid interface by ultrasonic assisted soldering
期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 卷号: 29, 期号: 4, 页码: 764-771
作者:
Yu, Wei-Yuan
;
Liu, Ying-Zong
;
Wu, Wei-Jie
;
Li, Fu-Xiang
;
Xing, Chun-Xiao
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Binary alloys
Brazing
Copper compounds
Diffusion
Dissolution
Intermetallics
Lead-free solders
Phase interfaces
Tin alloys
Tin compounds
Cu-Sn intermetallics
Dissolution model
Evolution of the microstructure
Formation and evolutions
Formation mechanism
Planar shape
Soldering process
Solid-liquid interfaces
Analysis and optimization of alloyed Al-p(+) region and rear contacts for highly efficient industrial n-type silicon solar cells
期刊论文
RSC ADVANCES, 2019, 卷号: 9, 页码: 6681-6688
作者:
Wei, Yi
;
Jiang, Xue
;
Lin, Yiren
;
Yang, Xichuan
;
Li, Guohui
收藏
  |  
浏览/下载:66/0
  |  
提交时间:2019/12/02
Aluminum
Annealing
Buffer layers
Electric resistance
Open circuit voltage
Silica
Silicon oxides
Solar cells, Cell efficiency
Fabrication process
Industrial processs
Interface conditions
Metal contacts
Metal-silicon interfaces
Recombination velocity
Series resistances, Silicon solar cells
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