CORC

在结果中检索

CORC

浏览/检索结果: 共589条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Preparation and Photoelectric Properties of p-Cu2O/n-ZnO Thin Film Heterojunction 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Ying;  Liu, Yantao;  Ma, Jianping;  Wang, Wenxia;  Peng, Xin
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20
Texture-classification Accelerated CNN Scheme for Fast Intra CU Partition in HEVC 会议论文
2019 DATA COMPRESSION CONFERENCE (DCC), 2019-01-01
作者:  Zhang, Yongfei;  Wang, Gang;  Tian, Rui;  Xu, Mai;  Kuo, C. C. Jay
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30
Microstructure and Mechanical Properties of Spray-formed High Zn-containing Al-Zn-Mg-Cu alloy 会议论文
PROCEEDINGS OF 2019 16TH INTERNATIONAL BHURBAN CONFERENCE ON APPLIED SCIENCES AND TECHNOLOGY (IBCAST), 2019-01-01
作者:  Ditta, Allah;  Wei Lijun;  Long, Li;  Xu Yanjin;  Naseem, Kashif
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/30
Efficient synthesis of the Cu-SAPO-44 zeolite with excellent activity for selective catalytic reduction of NOx by NH3 会议论文
8th Japan-China Workshop on Environmental Catalysis and Eco-Materials, DEC 05-06, 2017
作者:  Xin, Ying;  Zhang, Nana;  Wang, Xiao;  Li, Qian;  Ma, Xicheng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/31
An efficient and stable Cu/SiO2 catalyst for the syntheses of ethylene glycol and methanol via chemoselective hydrogenation of ethylene carbonate 会议论文
Chinese Acad Sci, Shanghai Adv Res Inst, Shanghai, PEOPLES R CHINA, JUL 17-21, 2017
作者:  Liu, Jiaju;  He, Peng;  Wang, Liguo;  Liu, Hui;  Cao, Yan
收藏  |  浏览/下载：23/0  |  提交时间：2019/06/21
Microstructure Evolution of Cu-15Ni-8Sn Alloy Prepared by Vertical Semi-continuous Casting with EMS 会议论文
9TH INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC PROCESSING OF MATERIALS (EPM2018), 2018-01-01
作者:  Guo, Zhongkai
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Electromagnetic Field on Microstructure and Properties of Cu-Cr-Co-Si Alloy 会议论文
9TH INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC PROCESSING OF MATERIALS (EPM2018), 2018-01-01
作者:  Sun, Xinglong;  Jie, Jinchuan;  Li, Tingju
收藏  |  浏览/下载：116/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Kuang, Jiameng;  Huang, Mingliang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Mechanism of Cu5Zn8 layer act as a diffusion barrier layer 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Jinye;  Li, Hua;  Huang, Ru;  Qi, Xiao;  Wang, Boyin
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02

©版权所有 ©2017 CSpace - Powered by CSpace