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Effects of Surface Size and Shape of Evaporation Area on SiC Single-Crystal Growth Using the PVT Method
期刊论文
CRYSTALS, 2024, 卷号: 14, 期号: 2, 页码: 11
作者:
Zhang, Yu
;
Wen, Xin
;
Chen, Nuofu
;
Zhang, Fang
;
Chen, Jikun
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2024/04/02
numerical simulation
SiC
single crystal growth
heat transfer
fluid flow
A Quantitative Representation of Damage and Failure Response of Three-Dimensional Textile SiC/SiC Ceramics Matrix Composites Subjected to Flexural Loading
期刊论文
JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, 3, 2023, 卷号: 145, 页码: 31001
作者:
Yang ZM(杨正茂)
;
Pang, Keji
;
Lei XQ(雷现奇)
;
Hu, Qing
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  |  
浏览/下载:13/0
  |  
提交时间:2023/06/15
ceramic matrix composites
silicon carbide
mechanical behavior
microstructure deformation
damage modeling/model
flexural loading
In-situ CT characterization of 2D woven SiCf/SiC composite loading under compression
期刊论文
SCIENCE AND ENGINEERING OF COMPOSITE MATERIALS, 2022, 卷号: 29, 期号: 1, 页码: 394-402
作者:
Guo, Weina
;
Gao, Yantao
;
Sun LJ(孙立娟)
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2022/12/20
SiCf
SiC composite
in-situ CT
microstructure
damage evolution
Thermally stable carbon-coated SiC/polydimethylsiloxane nanocomposites for EMI shielding in the terahertz range
期刊论文
MATERIALS RESEARCH BULLETIN, 2022, 卷号: 153, 页码: 9
作者:
Huang, Feirong
;
Fan, Shuting
;
Tian, Yuqi
;
Qu, Xinghao
;
Li, Xiyang
收藏
  |  
浏览/下载:170/0
  |  
提交时间:2022/09/16
ceramics
nanostructures
composites
electronic materials
thermodynamic properties
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
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  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Segregation and diffusion behaviours of helium at grain boundaries in silicon carbide ceramics: first-principles calculations and experimental investigations
期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2022, 卷号: 42
作者:
Sun, Jingjing
;
You, Yu-Wei
;
Wu, Xuebang
;
Song, Hong-Yue
;
Li, B. S.
收藏
  |  
浏览/下载:145/0
  |  
提交时间:2022/12/23
SiC ceramics
Grain boundaries
Helium segregation
First-principles calculations
Diffusion
Multi-channel Thermal Deformation Interference Measurement of the Telescope Supporting Frame in Spaceborne Gravitational Wave Detection
期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 4, 2022, 卷号: 34, 页码: 59
作者:
Shen J(沈嘉)
;
Zhao, Ya
;
Liu HS(刘河山)
;
Niu Y(牛宇)
;
Gao RH(高瑞弘)
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/10/23
Coefficient of thermal expansion (CTE)
Interferometry
Multi-channel
Carbon/silicon carbide(C/SiC)
Telescope
Lightweight and salt spray corrosion resistant porous SiC/FeSiCr hybrids for enhanced microwave absorption in the C-band
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2022, 卷号: 907, 页码: 9
作者:
Yan, Liuliu
;
Wang, Yuansheng
;
Li, Wanchong
;
Liao, Zhangqi
;
Wang, Xuan
收藏
  |  
浏览/下载:36/0
  |  
提交时间:2022/07/14
SiC foam
EM absorption performance
Compressive strength
Salt spray corrosion resistance
FeSiCr
Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics
期刊论文
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2022, 卷号: 304, 页码: 14
作者:
Hu, Zhongwei
;
Chen, Yue
;
Lai, Zhiyuan
;
Yu, Yiqing
;
Xu, Xipeng
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2022/08/10
Single-crystal silicon carbide
Vibration-assisted scratch
Double abrasive grains
Molecular dynamics
Transient Current Analysis of Silicon Carbide Neutron Detector Using SRIM and TCAD
期刊论文
IEEE SENSORS JOURNAL, 2022, 卷号: 22
作者:
Zhang, Lilong
;
Wang, Ying
;
Guo, Haomin
;
Yu, Chenghao
;
Hu, Haifan
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2022/12/23
Neutron detector
silicon carbide
transient current
charge collection
SRIM and TCAD
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