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CORC

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Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他
2016-01-01
Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Silicon-silicon anodic bonding process with embedded glass 其他
2015-01-01
Cui, W.P.; Liu, G.D.; Zhang, F.S.; Hu, H.; Gao, C.C.; Hao, Y.L.
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Quality evaluation and simulation of through-multilayer TSV integration process for memory stacking 其他
2015-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Jin, Yufeng; Ma, Shenglin
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03
Temporary bonding/debonding based on propylene carbonate 其他
2015-01-01
Zhu, Zhiyuan; Du, Hong; Guan, Yong; Wang, Hao; Yu, Min; Jin, Yufeng; Zhang, Zhao
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Low Temperature Multi-layer Wafer Level Package for Chip Scale Atomic Clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Quality Evaluation and Simulation of Through-Multilayer TSV Integration Process for Memory Stacking 其他
2015-01-01
Guan, Yang; Zeng, Qinghua; Chen, Jing; Jin, Yufeng; Ma, Shenglin
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Evaluation of Au/a-Si eutectic wafer level bonding process 其他
2014-01-01
Huang, Xian; He, Jun; Zhang, Li; Yang, Fang; Zhang, Dacheng
收藏  |  浏览/下载：6/0  |  提交时间：2015/11/13
Field-assisted titanium-glass bonding 其他
2014-01-01
Li, Tianyu; Zhang, Yiming; Luo, Jin; Chen, Jing
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/17
Mechanical strength of anchor-microbeam combined structure fabricated by silicon-on-glass process 其他
2014-01-01
He, Jun; Huang, Xian; Zhang, Li; Zhao, Danqi; Yang, Fang; Wang, Wei; Zhang, Dacheng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03

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