| Temporary bonding/debonding based on propylene carbonate | |
| Zhu, Zhiyuan ; Du, Hong ; Guan, Yong ; Wang, Hao ; Yu, Min ; Jin, Yufeng ; Zhang, Zhao | |
| 2015 | |
| 英文摘要 | This paper carried out extensive research about temporary bonding/debonding schemes based on propylene carbonate (PPC). The temporary bonding was investigated at different bonding temperatures and bonding time. The bonding pressure is 0.2 MPa. The highest shear strength of 4.1 MPa is achieved at bonding temperature of 150°C and bonding time of 20 min. The bonded wafers were debonded using thermal and chemical method. ? 2015 IEEE.; EI; 158-160 |
| 语种 | 英语 |
| 出处 | 16th International Conference on Electronic Packaging Technology, ICEPT 2015 |
| DOI标识 | 10.1109/ICEPT.2015.7236565 |
| 内容类型 | 其他 |
| 源URL | [http://ir.pku.edu.cn/handle/20.500.11897/436686]  |
| 专题 | 信息科学技术学院 |
| 推荐引用方式 GB/T 7714 | Zhu, Zhiyuan,Du, Hong,Guan, Yong,et al. Temporary bonding/debonding based on propylene carbonate. 2015-01-01. |
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