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CORC

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Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：6/0  |  提交时间：2021/02/02
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2021/02/02
Wafer-level optoelectronic packaging 专利
专利号: WO2019086953A1, 申请日期: 2019-05-09, 公开日期: 2019-05-09
作者:  LAM, YEE, LOY
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/30
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Enhancing airtightness of TGV through regulating interface energy for wafer-level vacuum packaging 期刊论文
Microsystem Technologies, 2018, 卷号: Vol.24 No.9, 页码: 3645-3649
作者:  Yunbin Kuang;  Dingbang Xiao;  Jian Zhou;  Ming Zhuo;  Wenyin Li
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/26
Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
Harbin, China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  Ching-Ping Wong
收藏  |  浏览/下载：14/0  |  提交时间：2018/02/02
The mathematical model and novel final test system for wafer-level packaging 期刊论文
IEEE Transactions on Industrial Informatics, 2017, 卷号: 13, 期号: 4, 页码: 1817-1824
作者:  Li, Junhui*;  Tian, Wenya;  Liao, Hailong;  Zhou, Can;  Liu, Xiaohe
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/03
Solid-State-Diffusion Bonding for Wafer-Level Fine-Pitch Cu/Sn/Cu Interconnect in 3-D Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 页码: 19-26
作者:  Wang, Junqiang;  Wang, Qian;  Wu, Zijian;  Wang, Dejun;  Cai, Jian
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02

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