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浏览/检索结果: 共2条，第1-2条 帮助 限定条件 发表日期：2022     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang 收藏  |  浏览/下载：18/0  |  提交时间：2022/08/09 Binary alloys  Copper  Copper alloys  Indium alloys  Lead-free solders  Microstructure  Shear flow  Silicon carbide  Soldering  Temperature  Thermoelectric equipment  Wide band gap semiconductors  Composite solders  Electronics devices  In-45cu composite solder paste  Intermetallics compounds  Microstructures and mechanical properties  Service temperature  Shears strength  Solderpaste  Ultrasonic action time  Ultrasonic-assisted TLP   Theoretical design and experimental study of the interlayer of Al/Mg bimetallic composite plate by solid-liquid cast rolling 期刊论文 Materials Science and Engineering A, 2022, 卷号: 835 作者:  Yang, H.K.;  Qiu, J.;  Cao, C.;  Li, Y.D.;  Song, Z.X. 收藏  |  浏览/下载：23/0  |  提交时间：2022/04/21 Aluminum alloys  Binary alloys  Calculations  Phase composition  Phase interfaces  Rolling  Tensile strength  Zinc alloys  6061 aluminum alloys  AZ31B magnesium alloys  Bimetallic composites  Bonding layers  Composite plates  Interface structures  Plate temperature  Shears strength  Solid/liquid  Zn interlayer