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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Microstructural evolution of a fine-grained Mg-Y-Nd alloy during superplastic deformation (EI收录) 会议 Guiyang, China, 作者:  Cao, Genghua[1];  Zhang, Datong[1] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/11 Electron microscopy  Friction  Friction stir welding  Grain boundaries  Grain boundary sliding  Grain growth  High resolution transmission electron microscopy  Microstructure  Neodymium alloys  Scanning electron microscopy  Superplastic deformation  Superplasticity  Transmission electron microscopy   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interc (CPCI-S收录) 会议 作者:  Liang, Shui-Bao;  Ke, Chang-Bo;  Tan, Meng-Ying;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 electromigration  microstructure evolution  phase segregation  Cu/Sn-Bi/Cu interconnect  phase field simulation   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array   Effect of Pb content on thermal fatigue life of mixed SnAgCu-SnPb solder joints (EI收录) 会议 Wuhan, China, 作者:  Wen, Qiang[1,2];  Li, Xunping[2];  Li, Guoyuan[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Electronics packaging  Lead  Lead  free solders  Microstructural evolution  Scanning electron microscopy  Soldered joints  Thermal fatigue