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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 发表日期：2017     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文 ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195 作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.;  Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China. 收藏  |  浏览/下载：22/0  |  提交时间：2018/01/10 Viscoplastic Creep  In-situ Ebsd  Polygonization  Grain Boundary Sliding  Strain Concentration   Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95 作者:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM 收藏  |  浏览/下载：17/0  |  提交时间：2017/10/27 Lead-free Solder  Annealing  Residual Stress  Nanoindentation  Constitutive Behaviour   Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文 INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570 作者:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China. 收藏  |  浏览/下载：13/0  |  提交时间：2017/10/27 Lead-free Solder  Cooling Condition  Annealing  Mechanical Property  Residual Stress   Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文 MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: - Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li 收藏  |  浏览/下载：24/0  |  提交时间：2017/08/17 Sn-58Bi solder  lead-free solder  microstructure   Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2017, 卷号: 38, 期号: 3 作者:  Mao, S.;  J. Liu and B. Ge 收藏  |  浏览/下载：17/0  |  提交时间：2018/06/13 Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 701, 页码: 187-195 作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F. 收藏  |  浏览/下载：9/0  |  提交时间：2017/12/25 Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录) 期刊论文 Journal of Alloys and Compounds, 2017, 卷号: 719, 页码: 365-375 作者:  Tang, Y.[1];  Luo, S.M.[1];  Huang, W.F.[1];  Pan, Y.C.[2];  Li, G.Y.[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Brittle fracture  Copper alloys  Ductile fracture  Fracture  Intermetallics  Lead  free solders  Manganese  Nanoparticles  Scanning electron microscopy  Silver  Silver alloys  Soldered joints  Soldering alloys  Strain rate  Tensile properties  Tensile testing  Tin  Tin alloys