Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint

doi:10.1007/s40195-021-01357-4

CORC > 金属研究所 > 中国科学院金属研究所

	Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint
	Chen, Yinbo 1,2; Gao, Zhaoqing 3; Liu, Zhi-Quan 1,4
刊名	ACTA METALLURGICA SINICA-ENGLISH LETTERS
	2022-01-06
页码	11
关键词	Sn-Bi-Ag solder Grain orientation Temperature gradient Aging Ag3Sn
ISSN号	1006-7191
DOI	10.1007/s40195-021-01357-4
通讯作者	Liu, Zhi-Quan(zqliu@siat.ac.cn)
英文摘要	Sn-Bi-X solders are widely used in electronic packaging industry. However, thermomigration (TM) behaviors of Sn-Bi-X solder joints and the orientations change of Bi grains under the temperature gradient are rarely reported. In this study, Sn-Bi57-Ag0.7/Cu solder joints were used to conduct a TM test under a temperature gradient of 625 degrees C/cm for 400 h, and an isothermal aging test at 85 degrees C was also conducted for comparison. The microstructural evolution of Sn-Bi-X solder joints after reflow, TM and isothermal aging were analyzed by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and electron probe microanalysis (EPMA). The results indicated that the Sn/Bi areal ratio after TM did not change significantly whether at the hot end (from 46.78%/52.12% to 50.90%/48.78%) or at the cold end (from 50.25%/49.64% to 48.71%/51.16%) compared with that of as-reflowed samples due to the insufficient thermal energy. The thickness of intermetallic compound (IMC) after TM at hot end (2.49 mu m) was very close to that of the IMC at cold end (2.52 mu m), which was also close to that of the aged samples. In addition, the preferred orientations of Sn and Bi grains in different Sn-Bi-Ag solder joints resulting from different conditions (reflow, TM and isothermal aging) were characterized by electron backscatter diffraction (EBSD). The obtained results demonstrated that both Sn and Bi grains had no preferred orientation whether after reflow or isothermal aging, while the orientation of Bi grains of the sample after TM changed from random direction to c-axis ([0001] direction) parallel to the heat flow. Ag3Sn could hinder the change of orientation of Bi grains under the temperature gradient, and the corresponding mechanism was also systematically illuminated. This study firstly revealed the orientation change of Bi grains under the temperature gradient, which would have a profound guiding significance for enhancing the reliabilities of Sn-Bi-Ag solder joints.
资助项目	National Key R&D Program of China[2017YFB0305700]
WOS研究方向	Metallurgy & Metallurgical Engineering
语种	英语
出版者	CHINESE ACAD SCIENCES, INST METAL RESEARCH
WOS记录号	WOS:000739243100002
资助机构	National Key R&D Program of China
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/173864]
专题	金属研究所_中国科学院金属研究所
通讯作者	Liu, Zhi-Quan
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China 4.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China
推荐引用方式 GB/T 7714	Chen, Yinbo,Gao, Zhaoqing,Liu, Zhi-Quan. Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2022:11.
APA	Chen, Yinbo,Gao, Zhaoqing,&Liu, Zhi-Quan.(2022).Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint.ACTA METALLURGICA SINICA-ENGLISH LETTERS,11.
MLA	Chen, Yinbo,et al."Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint".ACTA METALLURGICA SINICA-ENGLISH LETTERS (2022):11.