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北京大学 [9]

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期刊论文 [9]

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限定条件	专题：北京大学第一署名单位第一作者单位通讯作者单位

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	Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates 期刊论文 MICROGRAVITY SCIENCE AND TECHNOLOGY, 2016 Xu, Bingsheng; Chen, Junwei; Yuan, Zhangfu; Zang, Likun; Zhang, Lina; Wu, Yan 收藏 \| 浏览/下载：5/0 \| 提交时间：2017/12/03 Sn-3.0Ag-0.5Cu-xBi Sessile drop method Contact angle Spreading dynamics Interfaces SN-AG-CU LEAD-FREE SOLDERS BI ALLOYS RELIABILITY ELECTRONICS HYSTERESIS JOINTS SYSTEM
	Wettability and spreadability study of molten Sn-3.0Ag-0.5Cu wetting on V-shaped substrate 期刊论文 SOLDERING & SURFACE MOUNT TECHNOLOGY, 2016 Xu, Bingsheng; Wu, Yan; Zhang, Lina; Chen, Junwei; Yuan, Zhangfu 收藏 \| 浏览/下载：3/0 \| 提交时间：2017/12/04 Surface morphology Wettability SAC Lead-free solder Surface evolver V-shaped substrate DYNAMIC CONTACT-ANGLE LEAD-FREE SOLDERS TEMPERATURE-COEFFICIENT SURFACE-TENSION NANOSTRUCTURED SURFACES SIMULATION ANALYSIS SN-AG HYSTERESIS DROPLETS CU
	Dissolutive wetting process and interfacial characteristic of molten Sn-17Bi-0.5Cu alloy on copper substrate 期刊论文稀有金属, 2013 Xu, Bing-Sheng; Zang, Li-Kun; Yuan, Zhang-Fu; Wu, Yan; Zhou, Zhou 收藏 \| 浏览/下载：3/0 \| 提交时间：2015/11/10 Lead-free solder Reactive wetting Sessile drop method Interfaces SOLDER JOINTS CU SUBSTRATE TEMPERATURE-COEFFICIENT SURFACE-TENSION SN-BI WETTABILITY KINETICS SILICON GROWTH IMC
	Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K 期刊论文 colloids and surfaces a physicochemical and engineering aspects, 2012 Zang, Likun; Yuan, Zhangfu; Zhu, Yuanqing; Xu, Bingsheng; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏 \| 浏览/下载：2/0 \| 提交时间：2015/11/12 Surfaces and interfaces Intermetallics Metals and alloys Scanning electron microscopy (SEM) Microstructure LEAD-FREE SOLDERS SN-AG-CU SURFACE-TENSION MOLTEN SILICON WETTABILITY SUBSTRATE ALLOYS DYNAMICS SYSTEMS AL
	Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Alloys on Copper Substrates 期刊论文 materials transactions, 2012 Zhang, Xiaorui; Matsuura, Hiroyuki; Tsukihashi, Fumitaka; Yuan, Zhangfu 收藏 \| 浏览/下载：2/0 \| 提交时间：2015/11/16 wettability tin-based alloys sessile drop method LEAD-FREE SOLDERS WETTING BEHAVIOR TEMPERATURE REACTIVITY NI
	Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures 期刊论文 journal of electronic materials, 2012 Zang, Likun; Yuan, Zhangfu; Cao, Zhanmin; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏 \| 浏览/下载：3/0 \| 提交时间：2015/11/12 Wetting metals and alloys melting interface electronic materials LEAD-FREE SOLDERS BI-SN SYSTEM SURFACE-TENSION ALLOYS AG EQUILIBRIUM BEHAVIOR
	Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K 期刊论文应用表面科学, 2011 Zang, Likun; Yuan, Zhangfu; Xu, Hongyan; Xu, Bingsheng 收藏 \| 浏览/下载：5/0 \| 提交时间：2015/11/12 Pb-free solder Sessile drop method Contact angle Electronic materials LEAD-FREE SOLDERS BI-SN SYSTEM SURFACE-TENSION CU WETTABILITY BEHAVIOR ALLOYS AG
	Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate 期刊论文科学通报英文版, 2010 Zhang XiaoRui; Yuan ZhangFu; Zhao HongXin; Zang LiKun; Li JianQiang 收藏 \| 浏览/下载：4/0 \| 提交时间：2015/11/10 contact angle lead-free solder sessile drop method Sn-Ag-Cu intermetallic compounds LEAD-FREE SOLDERS SESSILE DROP METHOD SURFACE-TENSION INTERMETALLIC COMPOUNDS BI SOLDER CREEP
	Wettability of molten Sn-Bi-Cu solder on Cu substrate 期刊论文材料快报, 2009 Zang, Likun; Yuan, Zhangfu; Zhao, Hongxin; Zhang, Xiaorui 收藏 \| 浏览/下载：3/0 \| 提交时间：2015/11/12 Electronic materials Metals and alloys Intermetallic compound Wettability LEAD-FREE SOLDERS INTERFACIAL REACTIONS SURFACE-TENSION TEMPERATURE-COEFFICIENT ALLOY ZN AG

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