Wettability of molten Sn-Bi-Cu solder on Cu substrate

doi:10.1016/j.matlet.2009.06.052

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	Wettability of molten Sn-Bi-Cu solder on Cu substrate
	Zang, Likun ; Yuan, Zhangfu ; Zhao, Hongxin ; Zhang, Xiaorui
刊名	材料快报
	2009
关键词	Electronic materials Metals and alloys Intermetallic compound Wettability LEAD-FREE SOLDERS INTERFACIAL REACTIONS SURFACE-TENSION TEMPERATURE-COEFFICIENT ALLOY ZN AG
DOI	10.1016/j.matlet.2009.06.052
英文摘要	The wetting behavior of a new Sn-Bi-Cu Pb-firee solder on Cu substrate was investigated by sessile drop method under an Ar-H(2) flow in the temperature range from 493 K to 623 K. The contact angle curves tested at 548 K and 623 K are found to fit exponential rule very well. However. the contact angle curve tested under493 K is not well consistent with exponential rule, for which the spreading course may be classified into three stages. Equilibrium contact angles between Sn-Bi-Cu solder and Cu substrate decrease monotonously with the increase in temperature, which are 28 degrees, 24 degrees and 18 degrees at 493 K. 548 K and 623 K, respectively. The results show that 69.5Sn30Bi-0.5Cu/exhibits good wettability on Cu substrate. Intermetallics formed at the 69.5Sn-30Bi-0.5Cu/Cu interface are identified as Cu(6)Sn(5) adjacent to the solder and Cu(3)Sn adjacent to the Cu substrate, respectively. Formation of intermetallic seems to improve strong wetting of the substrate by the solder. (C) 2009 Elsevier B.V. All rights reserved.; Materials Science, Multidisciplinary; Physics, Applied; SCI(E); EI; 11; ARTICLE; 23; 2067-2069; 63
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/246850]
专题	工学院
推荐引用方式 GB/T 7714	Zang, Likun,Yuan, Zhangfu,Zhao, Hongxin,et al. Wettability of molten Sn-Bi-Cu solder on Cu substrate[J]. 材料快报,2009.
APA	Zang, Likun,Yuan, Zhangfu,Zhao, Hongxin,&Zhang, Xiaorui.(2009).Wettability of molten Sn-Bi-Cu solder on Cu substrate.材料快报.
MLA	Zang, Likun,et al."Wettability of molten Sn-Bi-Cu solder on Cu substrate".材料快报 (2009).