Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi   Melting on Cu Substrates

doi:10.1007/s12217-015-9484-3

CORC > 北京大学 > 工学院

	Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates
	Xu, Bingsheng ; Chen, Junwei ; Yuan, Zhangfu ; Zang, Likun ; Zhang, Lina ; Wu, Yan
刊名	MICROGRAVITY SCIENCE AND TECHNOLOGY
	2016
关键词	Sn-3.0Ag-0.5Cu-xBi Sessile drop method Contact angle Spreading dynamics Interfaces SN-AG-CU LEAD-FREE SOLDERS BI ALLOYS RELIABILITY ELECTRONICS HYSTERESIS JOINTS SYSTEM
DOI	10.1007/s12217-015-9484-3
英文摘要	The effects of Bi addition on the properties of Sn-3.0Ag-0.5Cu molten alloy on Cu substrates are discussed using wettability and interface microstructure analysis. The changes of the contact angles between Sn-3.0Ag-0.5Cu-xBi and Cu substrates with the spreading time are described by Dezellus model. It indicates that the spreading process is governed by the interfacial reaction during the dwelling time. The interface microstructure is observed to clarify the effects of reactions on the spreading behavior. It is found that Cu6Sn5 is formed adjacent to the solder and Cu3Sn appears over the substrate with Bi added at 613K, indicating that Bi exists between the intermetallics and the addition of Bi can hinder the diffusion of copper towards the interior of the solder. Therefore the existence of Bi decreases the agglomeration of Cu-Sn grains. The growth of intermetallics is thus limited and the shape of intermetallics transforms from scallop to zigzag consequently. However, the segregation phenomenon appears when the additive amount of Bi is more than 5.5mass %, which could lead to the occurrence of fracture and degrade the performance of Sn-3.0Ag-0.5Cu-xBi alloy. The results of the present study provide basic physical and chemical data for the application of lead-free solder in the future microgravity space environment.; Strategic Priority Research Program of the Chinese Academy of Sciences: SJ10-Recoverable Scientific Experiment Satellite [XDA04020411, XDA04020202-11]; SCI(E); EI; ARTICLE; zfyuan@pku.edu.cn; 2; 115-122; 28
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/437294]
专题	工学院
推荐引用方式 GB/T 7714	Xu, Bingsheng,Chen, Junwei,Yuan, Zhangfu,et al. Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates[J]. MICROGRAVITY SCIENCE AND TECHNOLOGY,2016.
APA	Xu, Bingsheng,Chen, Junwei,Yuan, Zhangfu,Zang, Likun,Zhang, Lina,&Wu, Yan.(2016).Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates.MICROGRAVITY SCIENCE AND TECHNOLOGY.
MLA	Xu, Bingsheng,et al."Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates".MICROGRAVITY SCIENCE AND TECHNOLOGY (2016).