Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on   different substrates at temperatures ranging from 503 K to 673 K

doi:10.1016/j.apsusc.2010.12.131

CORC > 北京大学 > 工学院

	Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K
	Zang, Likun ; Yuan, Zhangfu ; Xu, Hongyan ; Xu, Bingsheng
刊名	应用表面科学
	2011
关键词	Pb-free solder Sessile drop method Contact angle Electronic materials LEAD-FREE SOLDERS BI-SN SYSTEM SURFACE-TENSION CU WETTABILITY BEHAVIOR ALLOYS AG
DOI	10.1016/j.apsusc.2010.12.131
英文摘要	Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu have been investigated at temperatures ranging from 503 K to 673 K on Cu, Ni, stainless steel and quartz, respectively. The reactive wetting behavior of Sn-3.0Ag-0.5Cu melt alloy on Cu and Ni substrates were investigated. Contact angles decrease as exponential decay and equilibrium contact angles decrease between the solder and Cu, Ni substrates monotonously with the temperature increasing. The configuration of the triple line of Sn-3.0Ag-0.5Cu/Cu is discussed by the description of equilibrium. The calculated results based on experimental values of tension balances along each of the three interfaces at this final state show good agreement with theoretical analysis. Intermetallics of the Sn-3.0Ag-0.5Cu/Ni interface are identified as (Cu, Ni)(6)Sn(5) adjacent to the solder and Ni(3)Sn(4) adjacent to the Ni substrate, respectively. The contact angles between Sn-3.0Ag-0.5Cu and quartz, stainless steel substrates were measured to be greater than 90 degrees, which means non-wetting, in the temperature range from 503 K to 673 K. Liquid-solid interfacial energy between the solder and different substrates are obtained based on the surface tension of molten solder and equilibrium contact angles at different temperatures. These results are of practical interest for composite lead-free solders preparations and joining of Sn-3.0Ag-0.5Cu to various substrates. (c) 2010 Elsevier B.V. All rights reserved.; Chemistry, Physical; Materials Science, Coatings & Films; Physics, Applied; Physics, Condensed Matter; SCI(E); EI; 12; ARTICLE; 11; 4877-4884; 257
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/240444]
专题	工学院
推荐引用方式 GB/T 7714	Zang, Likun,Yuan, Zhangfu,Xu, Hongyan,et al. Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K[J]. 应用表面科学,2011.
APA	Zang, Likun,Yuan, Zhangfu,Xu, Hongyan,&Xu, Bingsheng.(2011).Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K.应用表面科学.
MLA	Zang, Likun,et al."Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K".应用表面科学 (2011).