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Comprehensive characterization of TSV etching performance with phase-contrast X-ray microtomography 期刊论文
JOURNAL OF SYNCHROTRON RADIATION, 2020, 卷号: 27, 页码: 1023-1032
作者:  Li, K;  Deng, B;  Zhang, HP;  Yu, FC;  Xue, YL
收藏  |  浏览/下载：10/0  |  提交时间：2021/09/06
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ;  Wang BY;  Chen L;  Chen L
收藏  |  浏览/下载：53/0  |  提交时间：2019/11/27
A New Prewetting Process of Through Silicon Vias (TSV) Electroplating for 3D Integration 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2019, 卷号: 28, 期号: 3
作者:  Li, Cao;  Nie, Jun;  Zou, Jinglong;  Liu, Sheng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/05
A new prewetting process of through silicon vias (TSV) electroplating for 3D integration 期刊论文
Journal of Microelectromechanical Systems, 2019, 卷号: 28, 期号: 3
作者:  Li, Cao;  Nie, Jun;  Zou, Jinglong;  Liu, Sheng;  Zheng, Huai
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/05
Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor 期刊论文
MICROMACHINES, 2018, 卷号: 9
作者:  Li, Haiwang;  Liu, Jiasi;  Xu, Tiantong;  Xia, Jingchao;  Tan, Xiao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/30
Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
Harbin, China
作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  Ching-Ping Wong
收藏  |  浏览/下载：14/0  |  提交时间：2018/02/02
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2017
Cui, Xiaole; Cui, Xiaoxin; Ni, Yewen; Miao, Min; Jin Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
An Effective Approach of Improving Electrical and Thermo-Mechanical Reliabilities of Through-Silicon Vias 期刊论文
2017, 卷号: 17, 页码: 106-112
作者:  Wang, Fengjuan;  Yu, Ningmei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20

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