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	A new prewetting process of through silicon vias (TSV) electroplating for 3D integration
	Li, Cao; Nie, Jun; Zou, Jinglong; Liu, Sheng; Zheng, Huai; Fei, Peng
刊名	Journal of Microelectromechanical Systems
	2019
卷号	28期号:3
ISSN号	1057-7157
DOI	10.1109/JMEMS.2019.2900372
URL标识	查看原文
收录类别	EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4242464
专题	武汉大学
推荐引用方式 GB/T 7714	Li, Cao,Nie, Jun,Zou, Jinglong,et al. A new prewetting process of through silicon vias (TSV) electroplating for 3D integration[J]. Journal of Microelectromechanical Systems,2019,28(3).
APA	Li, Cao,Nie, Jun,Zou, Jinglong,Liu, Sheng,Zheng, Huai,&Fei, Peng.(2019).A new prewetting process of through silicon vias (TSV) electroplating for 3D integration.Journal of Microelectromechanical Systems,28(3).
MLA	Li, Cao,et al."A new prewetting process of through silicon vias (TSV) electroplating for 3D integration".Journal of Microelectromechanical Systems 28.3(2019).

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