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金属研究所 [36]

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浏览/检索结果: 共137条，第1-10条

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	Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer 期刊论文 JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29 作者: Zhang, Ping; Zhang, Xian; Ding, Xin; Wang, Yanyan; Xiao, Chao 收藏 \| 浏览/下载：20/0 \| 提交时间：2022/12/23 Segregated structure Intermetallic compound Thermal conductivity Sliver interface layer
	Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603 作者: Huang, Hai; Chen, Bin; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin 收藏 \| 浏览/下载：88/0 \| 提交时间：2022/07/19 Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
	Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11 作者: Chen, Yinbo; Gao, Zhaoqing; Liu, Zhi-Quan 收藏 \| 浏览/下载：10/0 \| 提交时间：2022/07/01 Sn-Bi-Ag solder Grain orientation Temperature gradient Aging Ag3Sn
	Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11 作者: Chen, Yinbo; Wang, Changchang; Gao, Yue; Gao, Zhaoqing; Liu, Zhi-Quan 收藏 \| 浏览/下载：16/0 \| 提交时间：2022/01/27
	Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15 作者: Chen, Yinbo; Meng, Zhi-Chao; Gao, Li-Yin; Liu, Zhi-Quan 收藏 \| 浏览/下载：12/0 \| 提交时间：2021/03/15
	Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262 作者: Liu, C. Z.; Wang, J. J.; Zhu, M. W.; Liu, X. M.; Lu, T. N. 收藏 \| 浏览/下载：25/0 \| 提交时间：2021/02/03
	Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8 作者: Yang, Jie; Zhang, Qingke; Song, Zhenlun 收藏 \| 浏览/下载：133/0 \| 提交时间：2021/02/02 SnBi solder Ag and In addition microhardness nano-indentation impact toughness fracture mechanism
	Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：21/0 \| 提交时间：2020/11/14 Bismuth compounds Diffusion Electric resistance Electrodes Growth rate IV-VI semiconductors Microstructure Scanning electron microscopy Tin Tin compounds Transmission electron microscopy Diffusion process Electrical resistances Micro-structure evolutions Porous structures Thermodynamically stable Thermoelectric Volume diffusion X ray diffractometers
	Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481 作者: Cheng, Jinxuan; Hu, Xiaowu; Zhang, Zhe; Li, Qinglin 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/14 Binary alloys Diffusion Growth rate Soldering Atomic diffusions Compound layer Diffusion channels Diffusion process Micro-structure evolutions Plating thickness Solder joint reliability Solder joints
	Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788 作者: Bi, Xiaoyang; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：16/0 \| 提交时间：2022/03/01 Solder joints Ni-Co film Shear strength Atomic model Intermetallic compound First-principles calculations

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