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西安交通大学 [20]
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浏览/检索结果:
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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Turning single bubble sonoluminescence from blue in pure water to green by adding trace amount of carbon nanodots
期刊论文
ULTRASONICS SONOCHEMISTRY, 2021, 卷号: 78
作者:
Song, Dan
;
Xu, Wen
;
Luo, Man
;
You, Kaijun
;
Tang, Ju
收藏
  |  
浏览/下载:35/0
  |  
提交时间:2021/11/01
Carbon nanodots
Sonoluminescence
Free radical
Blackbody radiation
Characteristic emission
Enhanced ammonium removal on biochar from a new forestry waste by ultrasonic activation: Characteristics, mechanisms and evaluation
期刊论文
SCIENCE OF THE TOTAL ENVIRONMENT, 2021, 卷号: 778, 页码: 15
作者:
Wang, Tongtong
;
Li, Gaoliang
;
Yang, Kaiqi
;
Zhang, Xiaoyuan
;
Wang, Ke
收藏
  |  
浏览/下载:68/0
  |  
提交时间:2021/08/19
Caragana korshinskii biochar
Ultrasonic activation
Adsorption characteristics
Mechanisms
Ammonium
Numerical simulation of ultrasonic enhancement by acoustic streaming and thermal effect on mass transfer through a new computation model
期刊论文
International Journal of Heat and Mass Transfer, 2021, 卷号: 171
作者:
X. Chen
;
Bayanheshig
;
Q. Jiao
;
X. Tan and W. Wang
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2022/06/13
Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 1, 页码: 1073-1079
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Fengfeng
;
Wang, Yanhong
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2021/03/02
Copper
Tin
Ultrasonic effects
Ultrasonic testing
Ultrasonic waves
Wetting
Acoustic cavitations
Additional forces
Copper substrates
Cross-section morphology
Interfacial atoms
Ultrasonic sound
Ultrasonic vibration
Wetting balance methods
Study on fracture of tungsten wire induced by acoustic cavitation at different hydrostatic pressures and driving electric powers
期刊论文
ULTRASONICS SONOCHEMISTRY, 2020, 卷号: 68, 页码: 10
作者:
Zhang, Yurong
;
Zhang, Zhenjun
;
Wu, Junru
;
Liu, Yalu
;
Zhang, Mingjun
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2021/02/02
Acoustic cavitation
Hydrostatic pressure
Cavitation erosion
Fracture of tungsten wire
Study on fracture of tungsten wire induced by acoustic cavitation at different hydrostatic pressures and driving electric powers
期刊论文
ULTRASONICS SONOCHEMISTRY, 2020, 卷号: 68, 页码: 10
作者:
Zhang, Yurong
;
Zhang, Zhenjun
;
Wu, Junru
;
Liu, Yalu
;
Zhang, Mingjun
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2021/02/02
Acoustic cavitation
Hydrostatic pressure
Cavitation erosion
Fracture of tungsten wire
Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729
作者:
Yu, Weiyuan
;
Lei, Zhen
;
Sun, Xuemin
;
Wu, Baolei
;
Sun, Jungang
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2020/11/14
Acoustic streaming
Atoms
Cavitation
Copper
Dissolution
Liquids
Solubility
Tin
Ultrasonics
Cavitation bubble
Dissolution behavior
Dissolution rates
Method of finite elements
Saturated solubility
Solid solubilities
Solid-liquid interfaces
Ultrasonic cavitation
Effect of Power Ultrasound on Dissolution Behavior of Cu/Sn System
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 8, 页码: 2724-2729
作者:
Yu, Weiyuan
;
Lei, Zhen
;
Sun, Xuemin
;
Wu, Baolei
;
Sun, Jungang
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2022/02/17
Acoustic streaming
Atoms
Cavitation
Copper
Dissolution
Liquids
Solubility
Tin
Ultrasonics
Cavitation bubble
Dissolution behavior
Dissolution rates
Method of finite elements
Saturated solubility
Solid solubilities
Solid-liquid interfaces
Ultrasonic cavitation
Intermetallic Compound (IMC) Growth at Ni/Sn/Ni Interface Under Ultrasonic Treatment
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 4, 页码: 1402-1408
作者:
Liu, Yun
;
Yu, Weiyuan
;
Wang, Yanhong
;
Sun, Xuemin
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2022/02/17
Binary alloys
Cavitation
Dissolution
Grain boundaries
Intermetallics
Tin
Ultrasonic equipment
Acoustic cavitations
Bulk diffusions
Formation and evolutions
Intermetallic compound growths
Intermetallic grains
Power dependence
Ultrasonic cavitation
Ultrasonic treatments
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