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华南理工大学 [10]
内容类型
会议 [10]
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Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Comparison of two typhoon-induced storm surges at the Zhanjiang Coast (EI收录)
会议
Kuta, Bali, Indonesia,
作者:
Zhao, Xue[1]
;
Xie, Qiang[2]
;
Hong, Bo[3]
;
Xu, Hongzhou[2]
;
Chen, Lingfang[2]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Atmospheric pressure
Earth sciences
Floods
Geology
Storms
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
BGA solder joint
size effect
lead-free solder
interfacial reaction
microstructure
Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization (CPCI-S收录)
会议
作者:
Zhou, Min-Bo[1,2]
;
Feng, Jian-Qiang[1,2]
;
Yue, Wu[3]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/11
interfacial reaction
intermetallic compound
undercooling dwelling
low temperature soldering
Improving methane production during the anaerobic digestion of waste activated sludge: Cao-ultrasonic pretreatment and using different seed s (CPCI-S收录)
会议
作者:
Geng, Yucong[1,2]
;
Zhang, Bo[3]
;
Du, Lianzhu[4]
;
Tang, Zhi[1,2]
;
Li, Qiang[1,2]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
Waste activated sludge
anaerobic digestion
Cao-ultrasound pretreatment
seed sludge
methane production
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录)
会议
作者:
Huang, Lia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Sn58Bi
Sn3.0Ag0.5Cu
Mixed solder joint
Microstructure
interfacial reaction
Ball grid array
Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process (CPCI-S收录)
会议
作者:
Tan, Meng-Ying
;
Zhou, Min-Bo
;
Huang, Lia-Qiang
;
Ma, Fa-Qian
;
Ma, Xiao
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
surface defect
solder ball spattering
Sn-Bi solder paste
reflow soldering process
Comparison of two typhoon-induced storm surges at the Zhanjiang Coast (CPCI-S收录)
会议
作者:
Zhao, Xue[1]
;
Xie, Qiang[2]
;
Hong, Bo[3]
;
Xu, Hongzhou[2]
;
Chen, Lingfang[2]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Storm surge
Typhoon
Wind radius
Moving speed
Zhanjiang Coast
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