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浏览/检索结果: 共44条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录) 期刊论文 Journal of Alloys and Compounds, 2017, 卷号: 719, 页码: 365-375 作者:  Tang, Y.[1];  Luo, S.M.[1];  Huang, W.F.[1];  Pan, Y.C.[2];  Li, G.Y.[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Brittle fracture  Copper alloys  Ductile fracture  Fracture  Intermetallics  Lead  free solders  Manganese  Nanoparticles  Scanning electron microscopy  Silver  Silver alloys  Soldered joints  Soldering alloys  Strain rate  Tensile properties  Tensile testing  Tin  Tin alloys   Effect of Nano-TiO2particles on growth of interfacial Cu6Sn5and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2solder joints (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2016, 卷号: 684, 页码: 299-309 作者:  Tang, Y.[1];  Luo, S.M.[1];  Wang, K.Q.[1];  Li, G.Y.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Activation energy  Chemical activation  Copper compounds  Diffusion  Energy dispersive spectroscopy  Grain boundaries  Grain growth  Intermetallics  Lead  free solders  Scanning electron microscopy  Silver  Soldered joints  Soldering alloys  Titanium dioxide  X ray diffraction  X ray spectroscopy   Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn-3.0Ag-0.5Cu-xTiO2 composite solder (EI收录SCI收录) 期刊论文 Journal of Materials Science: Materials in Electronics, 2013, 卷号: 24, 页码: 1587-1594 作者:  Tang, Y.[1,2];  Pan, Y.C.[1];  Li, G.Y.[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/25 Adsorption  Microstructure  Nanoparticles  Scanning electron microscopy  Silver  Soldered joints  Soldering alloys  Thermodynamic properties  Titanium dioxide  Wetting  X ray diffraction analysis   Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2013, 卷号: 554, 页码: 195-203 作者:  Tang, Y.[1,2];  Li, G.Y.[1];  Pan, Y.C.[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/25 Adsorption  Curve fitting  Energy dispersive spectroscopy  Grain growth  Grain size and shape  Growth kinetics  Intermetallics  Kinetics  Nanoparticles  Ostwald ripening  Reaction kinetics  Scanning electron microscopy  Soldered joints  Soldering  Soldering alloys  Tin  Titanium dioxide  X ray diffraction analysis   Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling (CPCI-S收录) 会议论文 MICROELECTRONICS RELIABILITY 作者:  Chen, H. T.;  Wang, C. Q.;  Li, M. Y. 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/18 Influence of dopant on IMC growth and mechanical properties of Sn-3.5Ag-0.7Cu solder joints (CPCI-S收录) 会议论文 HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION 作者:  Li, G. Y.;  Jiang, X. B.[1];  Li, B.[1];  Chen, P.[1];  Liao, R.[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/17 Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection (EI收录) 会议论文 Journal of Materials Processing Technology, Singapore, Singapore, December 4, 2006 - December 6, 2006 作者:  Zhang, X.P.[1];  Yu, C.B.[1];  Zhang, Y.P.[1];  Shrestha, S.[2];  Dorn, L.[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/17 Creep  Laser beams  Lead  Silver  Soldering alloys  Tin alloys   Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录) 会议 作者:  Yue, Wu[1];  Zhou, Min-Bo[2,3];  Zhang, Xin-Ping[2,3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 laser jet solder ball bonding  Sn-3.0Ag-0.5Cu solder ball  wettability  surface contamination   Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 micro-scale solder joint  creep deformation  current density  electro-thermo-mechanical coupled loads