中国开放科研知识云: 检索

验证码:

换一张

忘记密码？记住我

取消登录

CORC

首页
科研机构
检索
知识图谱
申请加入
托管服务

在结果中检索

科研机构

兰州理工大学 [17]

内容类型

期刊论文 [17]

发表日期

知识图谱

CORC

已提交作品

待认领作品

已认领作品

未提交全文

浏览/检索结果: 共17条，第1-10条

帮助

限定条件	专题：兰州理工大学第一署名单位第一作者单位通讯作者单位

已选(0)清除条数/页：排序方式：
	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
	Study on asphalt volatile organic compounds emission reduction: A state-of-the-art review 期刊论文 Journal of Cleaner Production, 2021, 卷号: 318 作者: Wang, Menghao; Wang, Chaohui; Huang, Shuai; Yuan, Huazhi 收藏 \| 浏览/下载：5/0 \| 提交时间：2022/02/17 Asphalt Crosslinking Gas chromatography Organic polymers Porous materials Asphalt volatile organic compound Emission reduction Emission reduction agent Emission reduction effect Emission reduction mechanisms Engineering performance Reduction agents Reduction effects Volatile organic compound emission Volatile organics
	Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：16/0 \| 提交时间：2020/11/14 Bismuth compounds Diffusion barriers Gold Gold compounds Heat resistance Microstructure Nickel Open circuit voltage Soldering Barrier films Diffusion barrier films Electrical resistances Output current Reflow--soldering Solder joints Temperature differences Thermoelectric
	Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：21/0 \| 提交时间：2020/11/14 Bismuth compounds Diffusion Electric resistance Electrodes Growth rate IV-VI semiconductors Microstructure Scanning electron microscopy Tin Tin compounds Transmission electron microscopy Diffusion process Electrical resistances Micro-structure evolutions Porous structures Thermodynamically stable Thermoelectric Volume diffusion X ray diffractometers
	Performance prediction and cost-effectiveness analysis of a novel natural draft hybrid cooling system for power plants 期刊论文 Applied Energy, 2020, 卷号: 262 作者: Wei, Huimin; Huang, Xianwei; Chen, Lin; Yang, Lijun; Du, Xiaoze 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Cooling Cooling systems Cooling water Cost effectiveness Economic and social effects Electric connectors Iterative methods Mass transfer Thermoelectric equipment Water conservation Water resources Coal-fired power unit Cost effectiveness analysis Heat and mass transfer Hybrid cooling Natural draft dry cooling towers Performance prediction Visible plume Water consumption rate
	Anti-freezing of natural draft dry cooling system of power generation by water re-distribution during winter 期刊论文 International Journal of Heat and Mass Transfer, 2020, 卷号: 149 作者: Wei, Huimin; Yang, Xiaoru; Ge, Zhihua; Yang, Lijun; Du, Xiaoze 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/14 Cooling Cooling systems Cooling water Energy conservation Flow of water Freezing Lagrange multipliers Operating costs Thermoelectric equipment Anti-freezing Dry cooling systems Energy saving potential Entransy dissipation Freezing environment Lagrange multiplier method Thermal power generating units Waterside adjustments
	Microwave synthesis and enhancement of power factors of HfxTi1−xNiSn 期刊论文 Materials Letters, 2019, 卷号: 251, 页码: 13-17 作者: Li, Yu; Zheng, Rui; Lei, Ying; Chen, Wen; Wan, Rundong 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Electric power factor Electric properties Microstructure Microwave heating Microwaves Scanning electron microscopy Sintering Thermodynamic properties Thermoelectric equipment Bulk samples Hf-doped Microwave sintering Microwave synthesis Power factors Thermoelectric figure of merit Thermoelectric properties
	Microwave synthesis and enhancement of power factors of HfxTi1-xNiSn 期刊论文 MATERIALS LETTERS, 2019, 卷号: 251, 页码: 13-17 作者: Li, Yu; Zheng, Rui; Lei, Ying; Chen, Wen; Wan, Rundong 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/11/15 HfxTi1-xNiSn Microwave heating Microstructure Electrical properties Power factor Thermal properties
	Microwave synthesis and enhancement of power factors of HfxTi1−xNiSn 期刊论文 Materials Letters, 2019, 卷号: 251, 页码: 13-17 作者: Li, Yu; Zheng, Rui; Lei, Ying; Chen, Wen; Wan, Rundong 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Electric power factor Electric properties Microstructure Microwave heating Microwaves Scanning electron microscopy Sintering Thermodynamic properties Thermoelectric equipment Bulk samples Hf-doped Microwave sintering Microwave synthesis Power factors Thermoelectric figure of merit Thermoelectric properties
	Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者: Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Crystal orientation Deterioration Electrodes Substrates Thermoelectric equipment Aging treatment Brittle failures Cu electrodeposits Interfacial contact Isotropic microstructures Solder joints Spreadability Thermo-Electric materials

相关链接
欧盟学术资源开放存取平台
CALIS高校机构知识库
台湾学术机构典藏
香港机构知识库整合系统
中国科学院机构知识库网格系统

CORC
关于我们
服务条款
隐私条款

联系我们
0931-8270076
cspace@llas.ac.cn
China-OR

中文简体

©版权所有 ©2017 CSpace - Powered by CSpace