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Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2016
Xu, Bingsheng; Chen, Junwei; Yuan, Zhangfu; Zang, Likun; Zhang, Lina; Wu, Yan
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Dissolutive wetting process and interfacial characteristic of molten Sn-17Bi-0.5Cu alloy on copper substrate 期刊论文
稀有金属, 2013
Xu, Bing-Sheng; Zang, Li-Kun; Yuan, Zhang-Fu; Wu, Yan; Zhou, Zhou
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/10
Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K 期刊论文
应用表面科学, 2011
Zang, Likun; Yuan, Zhangfu; Xu, Hongyan; Xu, Bingsheng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/12
Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate 期刊论文
科学通报 英文版, 2010
Zhang XiaoRui; Yuan ZhangFu; Zhao HongXin; Zang LiKun; Li JianQiang
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/10
Wettability of molten Sn-Bi-Cu solder on Cu substrate 期刊论文
材料快报, 2009
Zang, Likun; Yuan, Zhangfu; Zhao, Hongxin; Zhang, Xiaorui
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/12
Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates 期刊论文
materials transactions, 2009
Kim, Taeyoung; Lee, Joonho; Kim, Yunkyum; Kim, Jong-Min; Yuan, Zhangfu
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16
Phase diagram of Sn-In-Zn system and its use for lead-free solder 期刊论文
物理化学学报, 1998
Zheng, YJ; Zhang, QY
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16

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