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华南理工大学 [19]
内容类型
会议 [19]
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Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulati (CPCI-S收录)
会议
作者:
Liang, Shui-Bao[1]
;
Ke, Chang-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
microvoids
solder interconnect
electrical field
phase field simulation
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录)
会议
作者:
Yue, Wu[1]
;
Zhou, Min-Bo[2,3]
;
Zhang, Xin-Ping[2,3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
laser jet solder ball bonding
Sn-3.0Ag-0.5Cu solder ball
wettability
surface contamination
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录)
会议
作者:
Liang, Shui-Bao[1]
;
Ke, Chang-Bo[1]
;
Ma, Wen-Jing[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
segregation
electromigration
Sn-Bi solder
interconnect
phase field simulation
Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder (CPCI-S收录)
会议
作者:
Ma, Wen-Jing[1]
;
Ke, Chang-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
Phase field crystal model
Microstructure evolution
Microcrack propagation
Strain
Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录)
会议
作者:
Li, Wang-Yun[1]
;
Cao, Shan-Shan[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
micro-scale solder joint
creep deformation
current density
electro-thermo-mechanical coupled loads
Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录)
会议
作者:
Li, Wang-Yun[1]
;
Cao, Shan-Shan[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
micro-scale solder joint
size effect
creep deformation
creep mechanism
fracture behavior
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al (CPCI-S收录)
会议
作者:
Chen, Guo-Liang[1,2]
;
Zhou, Min-Bo[1,2]
;
Zhang, Lang[1,2]
;
Lin, Yuan-Jiang[1,2]
;
Zhang, Yu-Peng[3]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
aluminum soldering
Sn-0.7Cu solder
interfacial microstructure
mechanical property
LED assembly
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