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浏览/检索结果: 共25条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 决策的年老化效应及其神经机制 会议 会议类型: 国内会议, 作者:  刘云瑞1谢超2雷旭1,4喻婧1,3,4 收藏  |  浏览/下载：16/0  |  提交时间：2018/11/07 决策  年龄差异  大尺度网络   Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulati (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 microvoids  solder interconnect  electrical field  phase field simulation   Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录) 会议 作者:  Yue, Wu[1];  Zhou, Min-Bo[2,3];  Zhang, Xin-Ping[2,3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 laser jet solder ball bonding  Sn-3.0Ag-0.5Cu solder ball  wettability  surface contamination   Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application (CPCI-S收录) 会议 作者:  Ji, Hongjun[1];  Li, Mingyu[1];  Qiao, Yunfei[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 ultraosnic-assisted soldering  Sn-based lead-free solder  automotive sensors  high power packaging  processes  interconnetion   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Ma, Wen-Jing[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 segregation  electromigration  Sn-Bi solder  interconnect  phase field simulation   Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder (CPCI-S收录) 会议 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 Phase field crystal model  Microstructure evolution  Microcrack propagation  Strain   Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 micro-scale solder joint  creep deformation  current density  electro-thermo-mechanical coupled loads   Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 micro-scale solder joint  size effect  creep deformation  creep mechanism  fracture behavior