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科研机构
清华大学 [2]
兰州理工大学 [1]
北京航空航天大学 [1]
内容类型
会议论文 [4]
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2019 [1]
2010 [2]
2009 [1]
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Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions
会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:
Mu, G. Q.
;
Qu, W. Q.
;
Wu, Y. C.
;
Zhuang, H. S.
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  |  
浏览/下载:64/0
  |  
提交时间:2019/12/30
Binary alloys
Hardness
Mechanical properties
Microstructure
Soldering
Ternary alloys
Thermal aging
Tin alloys
Aging conditions
Aging temperatures
Fracture feature
Interfacial compounds
Interfacial microstructure evolution
Sn-based solders
Solder interfaces
Thermal aging tests
Gold alloys
Linear features of interfaces between crystalline phases and their role on phase transformations
会议论文
Proceedings of an International Conference on Solid Solid Phase Transformations in Organic Materials 2005, Proceedings of an International Conference on Solid Solid Phase Transformations in Organic Materials 2005, Phoenix, AZ, USA, INSPEC
Zhang, W.-Z.
;
Yang, X.-P.
;
Ye, F.
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浏览/下载:6/0
Linear features of interfaces between crystalline phases and their role on phase transformations
会议论文
Solid-Solid Phase Transformations in Inorganic Material 2005, Vol 2, International Conference on Solid-Solid Phase Transformations in Inorganic Materials (PTM 2005), Phoenix, AZ, Web of Science
Zhang, W. -Z.
;
Yang, X. -P.
;
Ye, F.
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浏览/下载:4/0
Interfacial failure mechanism of 316LSS diffusion bonded joints
会议论文
Ottawa, ON, Canada, July 12, 2009 - July 17, 2009
作者:
Li, Shu-Xin
;
Xuan, Fu-Zhen
;
Tu, Shan-Tung
;
Yu, Shu-Rong
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  |  
浏览/下载:14/0
  |  
提交时间:2020/11/15
Adhesive joints
Chemical bonds
Chemical industry
Cracks
Diffusion
Diffusion bonding
Grain boundaries
Textures
Bonded joint
Chemo-mechanical system
Cracks initiations
In-situ observations
Interfacial failures
Intergranular crack
Micro voids
Micro-structure evolutions
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