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兰州理工大学 [22]
大连化学物理研究所 [19]
金属研究所 [13]
过程工程研究所 [9]
山东大学 [8]
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期刊论文 [114]
学位论文 [2]
发表日期
2019 [116]
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Constructing dual interfacial modification by synergetic electronic and ionic conductors: Toward high-performance LAGP-Based Li-S batteries
期刊论文
ENERGY STORAGE MATERIALS, 2019, 卷号: 23, 页码: 299
作者:
Li, Wenwen
;
Wang, Qing
;
Jin, Jun
;
Li, Yanpei
;
Wu, Meifen
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浏览/下载:85/0
  |  
提交时间:2019/12/31
Interfacial modification
Graphite layer
All-solid-state
LAGP electrolyte
Li-S batteries
Microstructure and properties of functional magnesium titanate ceramic joint brazed by bismuth-borate glass
期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2019, 卷号: 39, 期号: 15, 页码: 4901
作者:
Jiang, Chonglai
;
Lin, Panpa
;
Chen, Qianqian
;
Wang, Ce
;
Lin, Tiesong
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  |  
浏览/下载:336/0
  |  
提交时间:2019/12/26
Magnesium titanate ceramic
Bismuth-Borate glass braze
Interfacial reaction
Shear strength
Dielectric properties
An investigation on particle weakening in T6-treated SiC/Al-Zn-Mg-Cu composites
期刊论文
MATERIALS CHARACTERIZATION, 2019, 卷号: 158, 页码: 10
作者:
Ma, G. N.
;
Wang, D.
;
Liu, Z. Y.
;
Xiao, B. L.
;
Ma, Z. Y.
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  |  
浏览/下载:137/0
  |  
提交时间:2021/02/02
Metal matrix composites
Mechanical properties
Interfacial reaction
Ageing
Strengthening mechanisms
Wetting behavior and reaction mechanism of molten Si in contact with silica substrate
期刊论文
CERAMICS INTERNATIONAL, 2019, 卷号: 45, 期号: 17, 页码: 21365-21372
作者:
Wang, Qinghu
;
He, Gang
;
Deng, Shuxiang
;
Liu, Jun
;
Li, Xiaoyu
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  |  
浏览/下载:0/0
  |  
提交时间:2020/03/24
Wetting behavior
Reaction mechanism
Multicrystalline silicon
SiO2 substrate
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:
Yi, Xiong
;
Yi, Guangbin
;
Hu, Xiaowu
;
Li, Qinglin
;
Zhang, Ruhua
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  |  
浏览/下载:1/0
  |  
提交时间:2020/11/14
Atomic force microscopy
Coatings
Copper compounds
Electroplating
Gold
Growth rate
Lead-free solders
Metallic films
Scanning electron microscopy
Semiconductor doping
Silver alloys
Silver metallography
Soldering
Substrates
Surface roughness
Ternary alloys
Thermal aging
Tin alloys
Tin compounds
Tin metallography
X ray photoelectron spectroscopy
Benzotriazole(BTA)
Electroplated Cu films
Heterocyclic compound
Interfacial microstructure evolution
Isothermal aging
Kovar substrates
Low concentrations
Soldering process
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2019, 卷号: 32, 期号: 2, 页码: 73-81
作者:
Liu, Yun
;
Yu, Weiyuan
;
Sun, Xuemin
;
Wang, Fengfeng
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浏览/下载:0/0
  |  
提交时间:2020/06/16
Intermetallic compounds
Grooves
Ultrasonic vibration
Dissolution
IMC
Interfacial reaction mechanism of TiBw/Ti6Al4V composites and Inconel 718 alloys by GTAW heat transmission
期刊论文
SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2019, 页码: 9
作者:
Gao YaNan
;
Huang LuJun
;
Sun Yuan
;
An Qi
;
Zhang Jie
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  |  
浏览/下载:151/0
  |  
提交时间:2021/02/02
TiBw
Ti6Al4V composites
Inconel 718 alloys
interfacial reaction
heat transmission
microstructures
Two-dimensional materials for advanced Li-S batteries
期刊论文
ENERGY STORAGE MATERIALS, 2019, 卷号: 22, 页码: 284-310
作者:
Shao, Qinjun
;
Wu, Zhong-Shuai
;
Chen, Jian
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  |  
浏览/下载:69/0
  |  
提交时间:2019/12/02
A new acetal as a fluorescent probe for highly selective detection of Fe3+ and its application in bioimaging
期刊论文
IONICS, 2019, 卷号: 25, 期号: 11, 页码: 5259-5267
作者:
Wang, Min
;
Zhang, Yong-Ming
;
Zhao, Qin-Yi
;
Fu, Zhen-Hai
;
Zhang, Zhi-Hong
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  |  
浏览/下载:0/0
  |  
提交时间:2021/11/30
Wetting of liquid aluminum alloys on pure titanium at 873-973 K
期刊论文
Journal of Materials Research and Technology, 2019, 卷号: 8, 期号: 6, 页码: 5813-5822
作者:
Jin, Peng
;
Liu, Yibo
;
Sun, Qingjie
;
Lin, Qiaoli
;
Li, Junzhao
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2020/11/14
Activation energy
Binary alloys
Drops
Intermetallics
Mass transfer
Oxide films
Silicon compounds
Titanium
Titanium dioxide
Wetting
Decomposition energy
Empirical equations
Gibbs energy of formation
Interfacial mass transfer
Intermetallic layer
Sessile drop method
Spreading dynamics
Viscous dissipation
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