CORC

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CORC

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Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.;  Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
收藏  |  浏览/下载：22/0  |  提交时间：2018/01/10
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
Wang, Mingna; Wang, Jianqiu; Ke, Wei
收藏  |  浏览/下载：32/0  |  提交时间：2017/08/17
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
作者:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM
收藏  |  浏览/下载：17/0  |  提交时间：2017/10/27
Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570
作者:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China.
收藏  |  浏览/下载：13/0  |  提交时间：2017/10/27
Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 5, 页码: -
Yang, Fan; Zhang, Liang; Liu, Zhi-quan; Zhong, Su Juan; Ma, Jia; Bao, Li
收藏  |  浏览/下载：24/0  |  提交时间：2017/08/17
Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor 期刊论文
Hanjie Xuebao/Transactions of the China Welding Institution, 2017, 卷号: 38, 期号: 3
作者:  Mao, S.;  J. Liu and B. Ge
收藏  |  浏览/下载：17/0  |  提交时间：2018/06/13
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 701, 页码: 187-195
作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.
收藏  |  浏览/下载：9/0  |  提交时间：2017/12/25
Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录) 期刊论文
Journal of Alloys and Compounds, 2017, 卷号: 719, 页码: 365-375
作者:  Tang, Y.[1];  Luo, S.M.[1];  Huang, W.F.[1];  Pan, Y.C.[2];  Li, G.Y.[2]
收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24
Research on microstructures of double interfaces SAC305 solder joint by RPC 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:  Chen, Jibing*;  Wan, Nong;  Li, Juying;  He, Zhanwen;  Wu, Yiping
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/27
Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2017, 卷号: 29, 期号: 3, 页码: 151-155
作者:  Zhang, Liang;  Liu, Zhi-quan;  Yang, Fan;  Zhong, Su-juan
收藏  |  浏览/下载：23/0  |  提交时间：2021/02/02

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