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CORC

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中国地层花粉数据集 期刊论文
植物生态学报, 2023, 卷号: 47, 期号: 10, 页码: 1453-1463
作者:  周伯睿;  廖梦娜;  李凯;  徐德宇;  陈海燕
收藏  |  浏览/下载：2/0  |  提交时间：2024/03/05
Inhibition of Autophagy by a Small Molecule through Covalent Modification of the LC3 Protein 期刊论文
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2021, 页码: 11
作者:  Fan, Shijie;  Yue, Liyan;  Wan, Wei;  Zhang, Yuanyuan;  Zhang, Bidong
收藏  |  浏览/下载：80/0  |  提交时间：2021/12/16
PRMT1 is a novel molecular therapeutic target for clear cell renal cell carcinoma 期刊论文
THERANOSTICS, 2021, 卷号: 11, 期号: 11, 页码: 5387-5403
作者:  Wang, Jianfeng;  Wang, Chen;  Xu, Pan;  Li, Xiao;  Lu, Yongning
收藏  |  浏览/下载：128/0  |  提交时间：2021/05/24
Combined immunosuppressive treatment (CIST) in lupus nephritis: a multicenter, randomized controlled study 期刊论文
CLINICAL RHEUMATOLOGY, 2019, 卷号: 38, 期号: 4
作者:  Lin, Jin;  An, Yuan;  Zhou, Yunshan;  Bi, Liqi;  Liu, Bo
收藏  |  浏览/下载：45/0  |  提交时间：2019/12/05
Development and evaluation of a novel series of Nitroxoline-derived BET inhibitors with antitumor activity in renal cell carcinoma 期刊论文
ONCOGENESIS, 2018, 卷号: 7
作者:  Chen, Wei;  Zhang, Hao;  Chen, Zhifeng;  Jiang, Hao;  Liao, Liping
收藏  |  浏览/下载：108/0  |  提交时间：2019/01/08
Ultrasensitive detection of thiophenol based on a water-soluble pyrenyl probe 期刊论文
TALANTA, 2018, 卷号: 185, 页码: 146-150
作者:  Yao, Zhiyi;  Ge, Wenqi;  Guo, Mingwei;  Xiao, Keren;  Qiao, Yadong
收藏  |  浏览/下载：20/0  |  提交时间：2019/04/09
Ultrasensitive detection of thiophenol based on a water-soluble pyrenyl probe 期刊论文
Talanta, 2018, 卷号: 185, 页码: 146-150
作者:  Yao, Zhiyi;  Ge, Wenqi;  Guo, Mingwei;  Xiao, Keren;  Qiao, Yadong
收藏  |  浏览/下载：71/0  |  提交时间：2019/04/23
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02

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