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华南理工大学 [13]
内容类型
会议 [13]
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The Challenges and Coping Strategies of Teachers' Professional Development under the MOOC Era
会议
作者:
Zhou, Jixiang[1]
;
Liu, Jia[1]
;
Shu, Changhe[1]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
MOOC
Professional development of teachers
Teaching ability
Coping strategy
The Application and Prognostic Evaluation of STEMI Clinical Pathway in the Treatment of EPCI Patients (CPCI-S收录)
会议
作者:
Zhou, Yijun[1]
;
Ye, Zi[1]
;
Yan, Xiong[1]
;
Guang, Kaipang[1]
;
Peng, Jiang[1]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Finite element analysis on shear lag effect of concrete curved box girder under moving loads (CPCI-S收录)
会议
作者:
Lu, Hai-lin[1]
;
Wan, Chong-yong[1]
;
Zhou, Xiao-long[1]
;
Qian, Jia-qi[1]
;
Chen, Bin[2]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
moving load
concrete
finite element
curved box birder
shear lag effect
Levels and distributions of polybrominated diphenyl ethers, hexabromocyclododecane, and tetrabromobisphenol A in sediments from Taihu Lake, C (CPCI-S收录)
会议
作者:
Wang, Jingzhi[1,2]
;
Jia, Xuwei[1]
;
Gao, Shutao[1]
;
Zeng, Xiangying[1]
;
Li, Huiru[1]
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/04/11
Polybrominated diphenyl ethers
Hexabromocyclododecane
Tetrabromobisphenol A
Sediment
Taihu Lake
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Silk Modified Porous PLGA Microspheres for Cell Culture in Vitro (CPCI-S收录)
会议
作者:
Liu, D.[1]
;
Wu, H.[1]
;
Jia, Z.[1]
;
Zhang, X.[1]
;
Zhou, Z.[2,3]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
BGA solder joint
size effect
lead-free solder
interfacial reaction
microstructure
Multilayer PV-storage Microgrids Algorithm for the Dispatch of Distributed Network (EI收录)
会议
Melbourne, VIC, Australia,
作者:
Yang, Ping[1]
;
Zhang, Yu-Jia[1]
;
Xu, Zhi-Rong[1]
;
Yin, Xu[1]
;
Zhou, Shao-Xiong[2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Algorithms
Heuristic algorithms
Multilayers
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