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CORC

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Study on the effect of post curing on the mode II fracture energy of structural adhesive using a parameter identification approach 期刊论文
International Journal of Adhesion and Adhesives, 2019, 卷号: 95
作者:  Han, Xiao;  Chao, Yuexing;  Zhang, Wei;  Chao, Yuezhen;  Wu, Chengwei
收藏  |  浏览/下载：17/0  |  提交时间：2019/12/02
On the fracture behaviour of adhesively bonded CFRP hat-shaped thin-walled beam under axial crushing load: An experimental and modelling study 期刊论文
COMPOSITE STRUCTURES, 2019, 卷号: 215, 页码: 258-265
作者:  Han, Xiao;  Hou, Shaoqiang;  Ying, Liang;  Hou, Wenbin;  Aliyev, Husniddin
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02
High Strain Survivability of Piezoceramics by Optimal Bonding Adhesive Design 期刊论文
SENSORS, 2018, 卷号: 18
作者:  Sun, Hu;  Wang, Yishou;  Qing, Xinlin;  Wu, Zhanjun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Failure analysis of adhesively bonded steel corrugated sandwich structures under three-point bending 期刊论文
COMPOSITE STRUCTURES, 2018, 卷号: 184, 页码: 256-268
作者:  Yu, Ye;  Ying, Liang;  Hou, Wen-bin;  Hu, Ping;  Jia, Xiu-xian
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12
作者:  Yao, Mingjun;  Yu, Daquan;  Zhao, Ning;  Fan, Jun;  Xiao, Zhiyi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Reliable and high quality adhesive bonding for microfluidic devices 期刊论文
MICRO & NANO LETTERS, 2017, 卷号: 12, 页码: 90-94
作者:  Li, Jingmin;  Liang, Chao;  Zhang, Hao;  Liu, Chong
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02

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