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Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议
Wuhan, China,
作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/11
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议
Wuhan, China,
作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Effect of Pb content on thermal fatigue life of mixed SnAgCu-SnPb solder joints (EI收录) 会议
Wuhan, China,
作者:  Wen, Qiang[1,2];  Li, Xunping[2];  Li, Guoyuan[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11


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