×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
华南理工大学 [26]
内容类型
会议 [26]
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共26条,第1-10条
帮助
限定条件
内容类型:会议
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
作者升序
作者降序
题名升序
题名降序
发表日期升序
发表日期降序
提交时间升序
提交时间降序
Improving the corrosion resistance of hot-working mold steel against al alloy melt by coating (EI收录)
会议
Chongqing, China,
作者:
Yi, Yao Yong[1]
;
Luo, Zhe Min[2]
;
Ngai, Tungwai Leo[2]
;
Ngai, Sieglind[2]
;
Li, Lie Jun[2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Alloy steel
Aluminum
Aluminum coatings
Aluminum corrosion
Coatings
Corrosion
Corrosion resistance
Die casting
Energy dispersive spectroscopy
Hot working
Ion implantation
Molds
Scanning electron microscopy
Titanium alloys
X ray diffraction
Effect of heat treatment on morphology of Fe-rich intermetallics in Al-Cu alloys (CPCI-S收录)
会议
作者:
Lin, B.[1]
;
Zhang, W. W.[2]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/11
Al-Cu alloys
Iron-rich intermetallics
Solid-state phase transformation
Solution heat treatment
FEM and contour method study of quenching residual stress of 7050 aluminum alloy cross-shaped component (EI收录)
会议
Istanbul, Turkey,
作者:
Li, Yang[1,2,3]
;
Wu, Yunxin[1,2,3]
;
Gong, Hai[1,2,3]
;
Xiao, Feng[1,2,3]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Aluminum
Aluminum alloys
Deformation
Elastoplasticity
Heat transfer
Manufacture
Quenching
Residual stresses
Stress concentration
Stresses
Simulation of the superelasticity of shape memory alloys by MATLAB programming (EI收录)
会议
Hong Kong, Hong kong,
作者:
Ling, Yu Hong[1]
;
Huang, Ye Ming[1]
;
Ma, Hong Wei[1]
;
Guo, Gan Liang[1]
;
Wu, Yun Ze[2]
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/04/11
Computer simulation
Constitutive models
MATLAB
Numerical methods
Numerical models
Microstructure and mechanical property of Ti3AlC2/TiAl3 composite synthesized by hot pressing (EI收录)
会议
Chengdu, China,
作者:
Chen, Wei Ping[1]
;
Zeng, Yong[1]
;
Li, Xiao Mei[1]
;
Xiao, Hua Qiang[2]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
Aluminum
Ball milling
Bending strength
Cracks
Failure (mechanical)
Fracture toughness
Hot pressing
Mechanical properties
Milling (machining)
Powders
Scanning electron microscopy
Titanium alloys
Titanium compounds
Vickers hardness
X ray diffraction
X ray powder diffraction
Microstructure and mechanical properties of submerged friction stir processing Mg-Y-Nd alloy (EI收录)
会议
Chengdu, China,
作者:
Cao, Geng Hua[1]
;
Zhang, Da Tong[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Alloys
Electron microscopy
Friction
Grain boundaries
Grain refinement
Grain size and shape
Mechanical properties
Microstructure
Neodymium alloys
Scanning electron microscopy
Tensile strength
Tensile testing
Transmission electron microscopy
Tribology
Phase and Hyperfine Structures of Melt-spun Nanocrystalline (Ce1-xNdx)(16)Fe78B6 Alloys (CPCI-S收录)
会议
作者:
Zhao, L. Z.[1,2]
;
Yu, H. Y.[1]
;
Guo, W. T.[1,2]
;
Zhang, J. S.[1]
;
Zhang, Z. Y.[1]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Element segregation
Fe-57 Mossbauer spectrometry (MS)
magnetic moment
nanocrystalline
valence instability
Microstructural evolution of a fine-grained Mg-Y-Nd alloy during superplastic deformation (EI收录)
会议
Guiyang, China,
作者:
Cao, Genghua[1]
;
Zhang, Datong[1]
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/04/11
Electron microscopy
Friction
Friction stir welding
Grain boundaries
Grain boundary sliding
Grain growth
High resolution transmission electron microscopy
Microstructure
Neodymium alloys
Scanning electron microscopy
Superplastic deformation
Superplasticity
Transmission electron microscopy
Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application (CPCI-S收录)
会议
作者:
Ji, Hongjun[1]
;
Li, Mingyu[1]
;
Qiao, Yunfei[1]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
ultraosnic-assisted soldering
Sn-based lead-free solder
automotive sensors
high power packaging
processes
interconnetion
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
©版权所有 ©2017 CSpace - Powered by
CSpace