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CORC

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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Anodic bondable Li-Na-Al-B-Si-O glass-ceramics for Si - ULTCC heterogeneous integration 期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2019, 卷号: 39, 期号: 7, 页码: 2419
作者:  Chen, Guanyu;  Ma, Mingsheng;  Liu, Zhifu;  Wei, Anqing;  Zavabeti, Ali
收藏  |  浏览/下载：81/0  |  提交时间：2019/12/26
Preparation and characterization of epoxy-based composite with multilayered structure and high thermal conductivity 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6
作者:  Chen, Lu;  Xiao, Chao;  Tang, Yunlu;  Zhang, Xian;  Zheng, Kang
收藏  |  浏览/下载：36/0  |  提交时间：2020/11/26
Flexible packaging for microelectronic devices 专利
专利号: US9978895, 申请日期: 2018-05-22, 公开日期: 2018-05-22
作者:  ANDERSON, BENJAMIN JOHN;  NIELSON, GREGORY N.;  CRUZ-CAMPA, JOSE LUIS;  OKANDAN, MURAT;  LENTINE, ANTHONY L.
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/24
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05
Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging 期刊论文
Journal of Electronic Materials, 2018, 卷号: 47, 期号: 9, 页码: 5588-5594
作者:  Liu, Shengfa;  Xiong, Wenyong*;  Xiong, Jieran;  Tan, Guanghua;  Hu, Zhebing
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/04
Tuning the Oxidation Degree of Graphite toward Highly Thermally Conductive Graphite/Epoxy Composites 期刊论文
CHEMISTRY OF MATERIALS, 2018, 卷号: 30, 页码: 7473-7483
作者:  Sun, Wen;  Wang, Lida;  Yang, Zhengqing;  Zhu, Tianzhen;  Wu, Tingting
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique 期刊论文
IEEE Access, 2018, 卷号: 6
作者:  Zhu, Fulong;  Lin, Xinxin;  Zhang, Wei;  Fan, Jiajie;  Liu, Sheng
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05
Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moire Technique 期刊论文
IEEE ACCESS, 2018, 卷号: 6
作者:  Zhu, Fulong;  Lin, Xinxin;  Zhang, Wei;  Fan, Jiajie;  Liu, Sheng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/05
Design and Implementation of Micro-Liquid Jetting System Featuring Piezostack Actuator for Microelectronic Packaging 会议论文
International Conference on Electronics and Electrical Engineering Technology (EEET), SEP 19-21, 2018
作者:  Lu, Shizhou;  Ren, Chenliang;  Shan, Xiaohui;  Liu, Wei;  Zhu, Chenyu
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31

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