CORC

在结果中检索

CORC

浏览/检索结果: 共173条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
A Charge Density Model of Silicon-nanowire GAA MOSFET Incoroperating the Source-drian Tunneling Effect for IC Design 会议论文
Guilin, China, June 4-6, 2021
作者:  Cheng H(程贺);  Zhang C(张超);  Liu TF(刘铁锋);  Xie C(谢闯);  Yang ZJ(杨志家)
收藏  |  浏览/下载：11/0  |  提交时间：2022/02/04
A new method for directly locating single-event latchups using silicon pixel sensors in a gas detector 期刊论文
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2020, 卷号: 962, 页码: 6
作者:  Li, Zili;  Fan, Yan;  Wang, Zhen;  Liu, Jun;  Sun, Xiangming
收藏  |  浏览/下载：22/0  |  提交时间：2022/01/18
TID Response of Bulk Si PMOS FinFETs: Bias, Fin Width, and Orientation Dependence 期刊论文
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2020, 卷号: 67, 期号: 7, 页码: 1320-1325
作者:  Ren, ZX (Ren, Zhexuan)[ 1 ];  An, X (An, Xia)[ 1 ];  Li, GS (Li, Gensong)[ 1 ];  Chen, G (Chen, Gong)[ 1 ];  Li, M (Li, Ming)[ 1 ]
收藏  |  浏览/下载：35/0  |  提交时间：2020/09/09
High Performance and Excellent Stability of All-Solid-State Electrochromic Devices Based on a Li1.85AlOz Ion Conducting Layer 期刊论文
ACS SUSTAINABLE CHEMISTRY & ENGINEERING, 2019, 卷号: 7, 期号: 20, 页码: 17390
作者:  Xie, Lingling;  Zhao, Shuwen;  Zhu, Ying;  Zhang, Qixuan;  Chang, Tianci
收藏  |  浏览/下载：82/0  |  提交时间：2019/12/26
Off quadrature mach-zehnder modulator biasing 专利
专利号: US10425164, 申请日期: 2019-09-24, 公开日期: 2019-09-24
作者:  ROPE, TODD;  NAGARAJAN, RADHAKRISHNAN L.;  SHANKAR, HARI
收藏  |  浏览/下载：23/0  |  提交时间：2019/12/23
Single-Junction Organic Solar Cell Containing a Fluorinated Heptacyclic Carbazole-Based Ladder-Type Acceptor Affords over 13% Efficiency with Solution-Processed Cross-Linkable Fullerene as an Interfacial Layer 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2019, 卷号: 11, 期号: 34, 页码: 31069-31077
作者:  Chen, Tsung-Wei;  Chang, Chia-Chih;  Hsiao, Yu-Tang;  Chan, ChoonKee;  Hong, Ling
收藏  |  浏览/下载：73/0  |  提交时间：2019/09/30
Complementary Integrated Circuits Based on n-Type and p-Type Oxide Semiconductors for Applications Beyond Flat-Panel Displays 期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 卷号: 66, 期号: 2, 页码: 950-956
作者:  Li, Yunpeng;  Zhang, Jiawei;  Yang, Jin;  Yuan, Yvzhuo;  Hu, Zhenjia
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/11
LC Low-pass filter based on through-silicon via 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Huang, Jia;  Yu, Ningmei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20
A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Li, Yue;  Yu, Ningmei
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/20
An Effective Method of Reducing TSV Thermal Stress by STI 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Qu, Xiaoqing;  Yu, Ningmei
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/20

©版权所有 ©2017 CSpace - Powered by CSpace