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Linking Urbanization and the Environment: Conceptual and Empirical Advances 期刊论文
ANNUAL REVIEW OF ENVIRONMENT AND RESOURCES, VOL 42, 2017
Bai, Xuemei; McPhearson, Timon; Cleugh, Helen; Nagendra, Harini; Tong, Xin; Zhu, Tong; Zhu, Yong-Guan
收藏  |  浏览/下载：9/0  |  提交时间：2017/12/03
Poly(phosphoric acid) (PPA)-Promoted 5-exo-Cyclization of Iminium Ions Generated In Situ: A Facile Access to Functionalized Indene Derivatives 期刊论文
SYNLETT, 2017
Zhu, Yi-Fan; Geng, Xin-Le; Guan, Yong-Hong; Teng, Wei; Fan, Xiaohui
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration 期刊论文
MICROELECTRONIC ENGINEERING, 2016
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Guan, Yong; Miao, Min; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process 期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2016
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他
2015-01-01
Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Temporary bonding/debonding based on propylene carbonate 其他
2015-01-01
Zhu, Zhiyuan; Du, Hong; Guan, Yong; Wang, Hao; Yu, Min; Jin, Yufeng; Zhang, Zhao
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他
2014-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Crustal thickening prior to 38 Ma in southern Tibet: Evidence from lower crust-derived adakitic magmatism in the Gangdese Batholith 期刊论文
gondwana research, 2012
Guan, Qi; Zhu, Di-Cheng; Zhao, Zhi-Dan; Dong, Guo-Chen; Zhang, Liang-Liang; Li, Xiao-Wei; Liu, Min; Mo, Xuan-Xue; Liu, Yong-Sheng; Yuan, Hong-Lin
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16

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