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CORC

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Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions 会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:  Mu, G. Q.;  Qu, W. Q.;  Wu, Y. C.;  Zhuang, H. S.
收藏  |  浏览/下载：64/0  |  提交时间：2019/12/30
Formation mechanism of a cathodic serrated interface and voids under high current density 期刊论文
MATERIALS LETTERS, 2018, 卷号: 211, 页码: 191-194
作者:  Zhang, Z. H.[1,2];  Cao, H. J.[3];  Chen, H. T.[4]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
Interface reaction in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti solder foil 期刊论文
Journal of Materials Processing Technology, 2015, 卷号: 221, 页码: 285-290
作者:  Yu, Wei-Yuan;  Liu, Sen-Hui;  Liu, Xin-Ya;  Liu, Min-Pen;  Shi, Wei-Gang
收藏  |  浏览/下载：0/0  |  提交时间：2022/02/17
Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 591, 页码: 351-355
F. F. Tian; Z. Q. Liu; P. J. Shang; J. D. Guo
收藏  |  浏览/下载：28/0  |  提交时间：2014/04/18
Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文
Materials Letters, 2014, 卷号: 121, 页码: 185-187
F. F. Tian; P. J. Shang; Z. Q. Liu
收藏  |  浏览/下载：18/0  |  提交时间：2014/07/03
Dissolutive wetting process and interfacial characteristic of molten Sn-17Bi-0.5Cu alloy on copper substrate 期刊论文
稀有金属, 2013
Xu, Bing-Sheng; Zang, Li-Kun; Yuan, Zhang-Fu; Wu, Yan; Zhou, Zhou
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/10
Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640
L. M. Yang; Q. K. Zhang; Z. F. Zhang
收藏  |  浏览/下载：17/0  |  提交时间：2013/02/05
Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging 期刊论文
Philosophical Magazine Letters, 2011, 卷号: 91, 期号: 6, 页码: 410-417
P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
收藏  |  浏览/下载：19/0  |  提交时间：2012/04/13
Fabrication and properties of lead-free Sn-Ag-Cu-Ga solder alloy 期刊论文
2010, 2010
Chen Guohai; Ma Jusheng; Geng Zhiting
收藏  |  浏览/下载：7/0
Accumulated residual plastic strain of solder joints under thermal cycling 期刊论文
2010, 2010
Chen Guo-Hai; Ma Ju-Sheng
收藏  |  浏览/下载：5/0

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