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浏览/检索结果: 共3条，第1-3条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The effect of Pb contamination on the solidification behaviors and mechanical properties of backward compatible solder joints (EI收录) 会议论文 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 15, 2013 - July 19, 2013 作者:  Li, Xunping[1];  Bin, Zhou[1];  En, Yunfei[1];  Xiaoqi, He[1];  Wei, Xiongfeng[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Failure analysis  Integrated circuits  Lead  Mechanical properties  Melting point  Microstructure  Silver  Soldered joints  Soldering alloys  Solidification   Effects of Pb content on solidification behavior and microstructure on mixed solder alloy (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Wei, Xiongfeng[1,2];  Li, Xunping[2];  Zhoubin[2];  Wei, Guoqiang[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/15 Alloys  Electronics packaging  Eutectics  Lead  Microstructural evolution  Microstructure  Phase diagrams  Silver  Silver alloys  Soldering  Soldering alloys  Solidification  Tin alloys   Effects of Pb Content on Solidification Behavior and Microstructure on Mixed Solder Alloy (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Wei Xiongfeng[1,2];  Li Xunping[2];  Zhoubin[2];  Wei Guoqiang[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 mixed solder alloy  Pb content  Sn-Ag-Pb eutectic phase  solidification behavior  microstructure