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浏览/检索结果: 共13条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Hermetic Packaging of Kovar Alloy and Low-carbon Steel Structure in Hybrid Integrated Circuit (HIC) System Using Parallel Seam Welding Proces (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Wang, Junde[1];  He, Xiaoqi[1];  Li, Xunping[1];  En, Yunfei[1];  Zhang, Xinping[2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/12 hermetic packaging  parallel seam welding  microstructure  welding temperature field   Effect of Pb Content on Thermal Fatigue Life of Mixed SnAgCu-SnPb Solder Joints (CPCI-S收录) 会议 作者:  Wen Qiang[1,2];  Li Xunping[2];  Li Guoyuan[1] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/11 Mixed solder joints  Pb content  Thermal fatigue life   Research on thermal-electric coupling effect of the Copper Pillar Bump in the Flip Chip Packaging (CPCI-S收录) 会议 作者:  Fu Zhiwei[1,2];  Zhou Bin[1,2];  Yao Ruohe[1];  Li Xunping[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Copper pillar bumps  thermal-electric coupling  Joule heat effcet  current density   Research on thermal-electric coupling effect of the copper pillar bump in the flip chip packaging (EI收录) 会议 Wuhan, China, 作者:  Fu, Zhiwei[1,2];  Zhou, Bin[1,2];  Yao, Ruohe[1];  Li, Xunping[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Copper  Current density  Electronics packaging  Joule heating  Packaging  Stress concentration  Temperature distribution   Effect of Pb content on thermal fatigue life of mixed SnAgCu-SnPb solder joints (EI收录) 会议 Wuhan, China, 作者:  Wen, Qiang[1,2];  Li, Xunping[2];  Li, Guoyuan[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Electronics packaging  Lead  Lead  free solders  Microstructural evolution  Scanning electron microscopy  Soldered joints  Thermal fatigue   Critical factors on the hermetic characteristics of DC/DC power module (EI收录) 会议论文 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 15, 2013 - July 19, 2013 作者:  Li, Xunping[1];  He, Xiaoqi[1];  En, Yunfei[1];  Qi, Guo[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/15 Failure analysis  Finite element method  Glass  Integrated circuits   The effect of Pb contamination on the solidification behaviors and mechanical properties of backward compatible solder joints (EI收录) 会议论文 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 15, 2013 - July 19, 2013 作者:  Li, Xunping[1];  Bin, Zhou[1];  En, Yunfei[1];  Xiaoqi, He[1];  Wei, Xiongfeng[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Failure analysis  Integrated circuits  Lead  Mechanical properties  Melting point  Microstructure  Silver  Soldered joints  Soldering alloys  Solidification   Evaluation of PCB Constraint on Hermeticity Reliability of DC/DC Power Module by FEA Method (CPCI-S收录) 会议论文 PROCEEDINGS OF 2014 10TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY (ICRMS), VOLS I AND II 作者:  Zeng, Ling[1,2];  Li, Xunping[1];  He, Xiaoqi[1];  Li, Guoyuan[1];  Bao, Hengwei[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Hermeticity  DC/DC power module  PCB  FEA   Key Factors on the Accuracy of Measurement Temperature by Using Infrared Thermometer (CPCI-S收录) 会议论文 PROCEEDINGS OF 2014 10TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY (ICRMS), VOLS I AND II 作者:  Zeng, Ling[1,2];  Li, Xunping[1];  He, Xiaoqi[1];  Li, Guoyuan[1];  Wang, Zhangchao[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/12 infrared thermometer  DC/DC power module  measurement accuracy   Effects of Pb content on solidification behavior and microstructure on mixed solder alloy (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Wei, Xiongfeng[1,2];  Li, Xunping[2];  Zhoubin[2];  Wei, Guoqiang[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/15 Alloys  Electronics packaging  Eutectics  Lead  Microstructural evolution  Microstructure  Phase diagrams  Silver  Silver alloys  Soldering  Soldering alloys  Solidification  Tin alloys