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科研机构
兰州理工大学 [6]
北京大学 [2]
大连理工大学 [1]
内容类型
期刊论文 [7]
其他 [2]
发表日期
2020 [4]
2019 [2]
2017 [1]
2009 [2]
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Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2020/11/14
Bismuth compounds
Diffusion barriers
Gold
Gold compounds
Heat resistance
Microstructure
Nickel
Open circuit voltage
Soldering
Barrier films
Diffusion barrier films
Electrical resistances
Output current
Reflow--soldering
Solder joints
Temperature differences
Thermoelectric
Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint
期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 832
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2020/11/14
Bismuth compounds
Diffusion
Electric resistance
Electrodes
Growth rate
IV-VI semiconductors
Microstructure
Scanning electron microscopy
Tin
Tin compounds
Transmission electron microscopy
Diffusion process
Electrical resistances
Micro-structure evolutions
Porous structures
Thermodynamically stable
Thermoelectric
Volume diffusion
X ray diffractometers
Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints
期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Zhang, Zhe
;
Li, Qinglin
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2020/11/14
Binary alloys
Diffusion
Growth rate
Soldering
Atomic diffusions
Compound layer
Diffusion channels
Diffusion process
Micro-structure evolutions
Plating thickness
Solder joint reliability
Solder joints
Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint
期刊论文
Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
;
Jiang, Xiongxin
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2020/11/14
Ductile fracture
Microstructure
Soldering
Fracture mechanisms
IMC layer
Liquid-state reaction
Micro-structure evolutions
Ni additions
Reflow--soldering
Solder joints
Synergistic effect
Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material
期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Crystal orientation
Deterioration
Electrodes
Substrates
Thermoelectric equipment
Aging treatment
Brittle failures
Cu electrodeposits
Interfacial contact
Isotropic microstructures
Solder joints
Spreadability
Thermo-Electric materials
Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804
作者:
Cheng, Jinxuan
;
Hu, Xiaowu
;
Li, Qinglin
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  |  
浏览/下载:7/0
  |  
提交时间:2019/11/15
Extreme wave run-up and pressure on a vertical seawall
期刊论文
APPLIED OCEAN RESEARCH, 2017, 卷号: 67, 页码: 188-200
作者:
Ning, Dezhi
;
Wang, Rongquan
;
Chen, Lifen
;
Li, Jinxuan
;
Zang, Jun
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/09
Extreme sea states
Wave pressure
Wave run-up
Fully nonlinear potential flow theory
Coastal vertical seawall
A scheme of photonic notch filter using DGD method for radio-over-fiber communication systems
其他
2009-01-01
Gao, Hanhong
;
Wu, Jinxuan
;
Tu, Zhao
;
Zhang, Cheng
;
Wu, Dandan
;
Hu, Weiwei
;
Chen, Zhangyuan
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
A Scheme of Photonic Notch Filter Using DGD Method for Radio-over-Fiber Communication Systems
其他
2009-01-01
Gao, Hanhong
;
Wu, Jinxuan
;
Tu, Zhao
;
Zhang, Cheng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2015/11/13
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