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CORC

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Neutron-induced single event upset simulation in Geant4 for three-dimensional die-stacked SRAM* 期刊论文
CHINESE PHYSICS B, 2021, 卷号: 30, 期号: 3, 页码: 8
作者:  Mo, Li-Hua;  Ye, Bing;  Liu, Jie;  Luo, Jie;  Sun, You-Mei
收藏  |  浏览/下载：33/0  |  提交时间：2021/12/10
LC Low-pass filter based on through-silicon via 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Huang, Jia;  Yu, Ningmei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20
A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Li, Yue;  Yu, Ningmei
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/20
An Effective Method of Reducing TSV Thermal Stress by STI 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Qu, Xiaoqing;  Yu, Ningmei
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/20
Materials, processing and reliability of low temperature bonding in 3D chip stacking 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 750, 页码: 980-995
作者:  Zhang, L;  Liu, ZQ;  Chen, SW;  Wang, YD;  Long, WM
收藏  |  浏览/下载：18/0  |  提交时间：2018/12/25
Materials, processing and reliability of low temperature bonding in 3D chip stacking 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 750, 页码: 980-995
作者:  Zhang, Liang;  Liu, Zhi-quan;  Chen, Sinn-Wen;  Wang, Yao-dong;  Long, Wei-Min
收藏  |  浏览/下载：27/0  |  提交时间：2021/02/02
A low-pass filter made up of the cylindrical through-silicon-via 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Fengjuan;  Huang, Jia;  Yu, Ningmei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 会议论文
18th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, SINGAPORE, 2016-11-30
作者:  Liu, Huan;  Zeng, Qinghua;  Guan, Yong;  Fang, Runiu;  Sun, Xin
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
SEU Reliability Evaluation of 3D ICs 期刊论文
Electronics Letters, 2015
作者:  Huiyun Li;  Xiaobo Hu;  Cuiping Shao;  Jianbin Zhou;  Guoqing Xu
收藏  |  浏览/下载：11/0  |  提交时间：2016/01/27
Stochastic Wire-Length Model with TSV Placement on Periphery Area 会议论文
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, 新加坡
作者:  Ling, Jianhui;  Li, Huiyun;  Xu, Guoqing;  Xiong, Liying
收藏  |  浏览/下载：16/0  |  提交时间：2015/09/01

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