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金属研究所 [7]

华南理工大学 [4]

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西安光学精密机械研究... [1]

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期刊论文 [11]

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	Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者: Gao, Li-Yin; Cui, Xian-Wei; Tian, Fei-Fei; Liu, Zhi-Quan 收藏 \| 浏览/下载：46/0 \| 提交时间：2021/02/02 Mixed soldering ball grid array solidification crack shrinkage failure mechanism
	Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者: Gao, Li-Yin; Cui, Xian-Wei; Tian, Fei-Fei; Liu, Zhi-Quan 收藏 \| 浏览/下载：42/0 \| 提交时间：2021/02/02 Mixed soldering ball grid array solidification crack shrinkage failure mechanism
	Initial thermal stress and strain effects on thermal mechanical stability of through silicon via 期刊论文 MICROELECTRONIC ENGINEERING, 2016 Sun, Yunna; Sun, Shi; Zhang, Yazhou; Luo, Jiangbo; Wang, Yan; Ding, Guifu; Jin, Yufeng 收藏 \| 浏览/下载：6/0 \| 提交时间：2017/12/03 IC packaging and fabricating Thermal load Initial thermal stress and deformation Thermal mechanical reliability THROUGH-SILICON FATIGUE COPPER TSV VIAS
	Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints in reflow process (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2013, 卷号: 554, 页码: 195-203 作者: Tang, Y.[1,2]; Li, G.Y.[1]; Pan, Y.C.[1] 收藏 \| 浏览/下载：6/0 \| 提交时间：2019/04/25 Adsorption Curve fitting Energy dispersive spectroscopy Grain growth Grain size and shape Growth kinetics Intermetallics Kinetics Nanoparticles Ostwald ripening Reaction kinetics Scanning electron microscopy Soldered joints Soldering Soldering alloys Tin Titanium dioxide X ray diffraction analysis
	Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录) 期刊论文 Journal of Materials Science: Materials in Electronics, 2012, 卷号: 23, 页码: 1543-1551 作者: Zhou, M.B.[1]; Ma, X.[1]; Zhang, X.P.[1,2] 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/04/26 Differential scanning calorimetry Flip chip devices Interface states Intermetallics Liquids Phase interfaces Soldering alloys Tin
	小型SMT回流焊炉的PID控制实现期刊论文 2010, 2010 徐苾璇; 侯进振; 刘学平; 毛乐山; XI Bi-xuan; HOU Jin-zhen; LIU Xue-ping; MAO Le-shan 收藏 \| 浏览/下载：2/0
	Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates 期刊论文 ACTA MATERIALIA, 2009, 卷号: 57, 期号: 16, 页码: 4697-4706 作者: Shang, P. J.; Liu, Z. Q.; Pang, X. Y.; Li, D. X.; Shang, J. K. 收藏 \| 浏览/下载：0/0 \| 提交时间：2021/02/02 Cu3Sn Growth mechanism Interface Soldering Transmission electron microscopy
	Growth mechanisms of Cu(3)Sn on polycrystalline and single crystalline Cu substrates 期刊论文 Acta Materialia, 2009, 卷号: 57, 期号: 16, 页码: 4697-4706 P. J. Shang; Z. Q. Liu; X. Y. Pang; D. X. Li; J. K. Shang 收藏 \| 浏览/下载：20/0 \| 提交时间：2012/04/13 Cu(3)Sn Growth mechanism Interface Soldering Transmission electron microscopy solder joints interfacial reactions intermetallic growth reactive interface diffusion couples molten sn temperature technology copper layers
	Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling 期刊论文 Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91 W. Wang; Z. G. Wang; A. P. Xian; J. K. Shang 收藏 \| 浏览/下载：12/0 \| 提交时间：2012/04/13 CBGA thermal cycling FEM assembly cracking solder joint reliability level reliability flex-substrate interconnect snagcu bga segregation packages behavior bismuth
	Dalian 期刊论文 Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91 作者: Wei WANG; Zhongguang WANG; Aiping XIAN; Jianku SHANG 收藏 \| 浏览/下载：10/0 \| 提交时间：2021/02/02 CBGA Thermal cycling FEM Assembly Cracking

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