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CORC

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Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
收藏  |  浏览/下载：15/0  |  提交时间：2021/02/03
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
作者:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan
收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02
Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 5, 页码: 3876-3889
作者:  Xu, Tao;  Hu, Xiaowu;  Li, Jiayin;  Li, Qinglin
收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02
Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 7
作者:  Bao, Nifa;  Hu, Xiaowu;  Li, Qinglin;  Li, Shuang
收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05

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