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浏览/检索结果:
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Effect of geometry error on accuracy of large-diameter pads used for CMP dressing
期刊论文
International Journal of Advanced Manufacturing Technology, 2019, 卷号: 100, 页码: 1505-1520
作者:
Ban, X.X.
;
Zhao, H.Y.
;
Zhao, S.J.
;
Xie, R.Q.
;
Gu, Y.W.
收藏
  |  
浏览/下载:14/0
  |  
提交时间:2019/11/19
Chemical mechanical polishing(CMP)
Geometry errors
Measured values
Polishing pads
Polyurethane pads
Profile accuracies
Spherical surface
Surface profiles
Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechanical polishing
期刊论文
TRIBOLOGY INTERNATIONAL, 2019, 卷号: 138, 页码: 307-315
作者:
Wang, Lin
;
Zhou, Ping
;
Yan, Ying
;
Kang, Renke
;
Guo, Dongming
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/02
CMP
Pad asperity
Material removal rate
Chemical-mechanical synergy
Environment friendly chemical mechanical polishing of copper
期刊论文
APPLIED SURFACE SCIENCE, 2019, 卷号: 467, 页码: 5-11
作者:
Zhang, Zhenyu
;
Cui, Junfeng
;
Zhang, Jiabo
;
Liu, Dongdong
;
Yu, Zhijian
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/12/02
Cu
COS
CMP
H2O2
Chelating
Atomistic mechanisms of chemical mechanical polishing of diamond (100) in aqueous H2O2/pure H2O: Molecular dynamics simulations using reactive force field (ReaxFF)
期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2019, 卷号: 157, 页码: 99-106
作者:
Guo, Xiaoguang
;
Yuan, Song
;
Wang, Xiaoli
;
Jin, Zhuji
;
Kang, Renke
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2019/12/02
Molecular dynamics
ReaxFF
CMP
Diamond
Mechanochemistry
Investigation of effects of pattern structures arrangement on chemical mechanical polishing process
会议论文
Shanghai, China, March 11, 2018 - March 12, 2018
作者:
Wu, Lixiao
;
Hahn, Sookap
;
Yan, Changfeng
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  |  
浏览/下载:1/0
  |  
提交时间:2020/11/15
Chemical mechanical polishing
Pressure distribution
Semiconductor device manufacture
Signal processing
Silicon wafers
Textile printing
Chemical-mechanical polishing process
Contact pressure distribution
Pattern arrangement
Pattern structure
Polishing processs
Splitting signals
Atomistic mechanisms of Cu CMP in aqueous H2O2: Molecular dynamics simulations using ReaxFF reactive force field
期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2018, 卷号: 155, 页码: 476-482
作者:
Guo, Xiaoguang
;
Wang, Xiaoli
;
Jin, Zhuji
;
Kang, Renke
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/02
Copper
Chemical mechanical polishing (CMP)
ReaxFF reactive force field
Polishing pressure
Improvement and application of pad conditioning accuracy in chemical mechanical polishing
期刊论文
Optical Engineering, 2018, 卷号: 57
作者:
Ban, Xinxing
;
Zhao, Huiying
;
Zhu, Xueliang
;
Zhao, Shijie
;
Xie, Ruiqing
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/11/26
Application process
Chemical mechanical polishing(CMP)
Density distributions
Diamond conditioners
Kinematic Analysis
Optical processing
Planarity
Process parameters
Effect of motion accuracy on material removal during the CMP process for large-aperture plane optics
期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 94, 页码: 105-119
作者:
Zhang, C. P.
;
Zhao, H. Y.
;
Xie, R. Q.
;
Zhao, Z. X.
;
Gu, Y. W.
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/11/26
Chemical mechanical polishing
Run-out error
Stitching measurement
Uneven removal
Polishing efficiency and accuracy
Gas hydrostatic rotary table
Large-aperture optics
A novel approach of chemical mechanical polishing for a titanium alloy using an environment-friendly slurry
期刊论文
APPLIED SURFACE SCIENCE, 2018, 卷号: 427, 页码: 409-415
作者:
Zhang, Zhenyu
;
Shi, Zhifeng
;
Du, Yuefeng
;
Yu, Zhijian
;
Guo, Liangchao
收藏
  |  
浏览/下载:150/0
  |  
提交时间:2018/12/04
Commercially Pure Titanium
Ti-6al-4v
Ti
Fatigue
Deposition
Surface
Layer
Steel
Films
A novel approach of chemical mechanical polishing for a titanium alloy using an environment-friendly slurry
期刊论文
APPLIED SURFACE SCIENCE, 2018, 卷号: 427, 页码: 409-415
作者:
Yu, Zhijian
;
Guo, Dongming
;
Guo, Liangchao
;
Du, Yuefeng
;
Shi, Zhifeng
收藏
  |  
浏览/下载:152/0
  |  
提交时间:2018/12/04
Commercially Pure Titanium
Ti-6al-4v
Ti
Fatigue
Deposition
Surface
Layer
Steel
Films
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