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浏览/检索结果: 共17条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Biochar from Chinese herb residues as adsorbent for toxic metals removal (EI收录) 会议 Bangkok, Thailand, 作者:  Liu, Guocheng[1];  Huang, Yu[2];  Xu, Lina[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Adsorbents  Cadmium  Cadmium compounds  Chemicals removal (water treatment)  Heavy metals  Lead  Metal ions  Metals  Plants (botany)   The selection of mine tunnel wastewater treatment process and its application effect (EI收录) 会议 作者:  Ma, Bangding[1,2];  Chen, Jian[3];  Zhao, Wenyu[3];  Liu, Kanghuai[3];  Chen, Xi[4] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Cadmium  Emission control  Equipment  Filtration  Groundwater  Heavy metals  Investments  Lead  Lead deposits  Ore deposits  Ores  Reclamation  Sewage pumping plants  Water treatment plants  Zinc  Zinc deposits  Zinc mines   Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   MEASUREMENTS OF FINE STRUCTURES IN THE LEAD-BISMUTH EUTECTIC ALLOY MELTS BY DIFFERENTIAL SCANNING CALORIMETRY (CPCI-S收录) 会议 作者:  Ye, Changqing[1];  Li, Qiulin[1];  Wu, Ping[2];  Tang, Guoyi[3];  Liu, Wei[4] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 lead-bismuth eutectic  differential scanning calorimetry  chemical clusters   Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application (CPCI-S收录) 会议 作者:  Ji, Hongjun[1];  Li, Mingyu[1];  Qiao, Yunfei[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 ultraosnic-assisted soldering  Sn-based lead-free solder  automotive sensors  high power packaging  processes  interconnetion   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Yangtze River: The potential ecological risk of heavy metals in sediment from 1996 to 2012 (EI收录) 会议 Bangkok, Thailand, 作者:  Song, Xinyu[1];  Xu, Lina[1];  Dai, Yanhui[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 Aquatic ecosystems  Cadmium  Copper  Ecology  Engineering research  Heavy metals  Lead  Risk assessment  Rivers  Sediments  Watersheds   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Identifying Lead User in Mass Collaborative Innovation Community: Based on Knowledge Supernetwork (CPCI-S收录) 会议 作者:  Li, Zhihong[1];  Tang, Hongting[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Lead user  Knowledge supernetwork  Mass collaborative innovation community  Knowledge management   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure