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Solvent responsive single-material inverse opal polymer actuator with structural color switching 期刊论文
Journal of Materials Science, 2020, 卷号: 55, 页码: 817-827
作者:  Wang, Yunpeng;  Niu, Wenbin;  Zhang, Shufen;  Ju, Benzhi
收藏  |  浏览/下载：47/0  |  提交时间：2019/11/29
Electrophilic substitution reaction as a facile and general approach for reactive removal of native ligands from nanocrystals surface 期刊论文
NANOTECHNOLOGY, 2019, 卷号: 30, 页码: 015701
作者:  Zhao, Kai;  Niu, Wenbin;  Wang, Yunpeng;  Zhang, Shufen
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Prediction of vibration characteristics of blisks using similitude models 期刊论文
MECHANICS BASED DESIGN OF STRUCTURES AND MACHINES, 2019, 卷号: 47, 页码: 121-135
作者:  Luo, Zhong;  Wang, You;  Zhai, Jingyu;  Zhu, Yunpeng;  Wang, Deyou
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Geometrical Effects of Cu@Ag Core-Shell Nanoparticles Treated Flux on the Growth Behaviour of Intermetallics in Sn/Cu Solder Joints 期刊论文
ELECTRONIC MATERIALS LETTERS, 2019, 卷号: 15, 页码: 253-265
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Wu, Yingchao
收藏  |  浏览/下载：29/0  |  提交时间：2019/12/02
Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux 期刊论文
THIN SOLID FILMS, 2019, 卷号: 669, 页码: 198-207
作者:  Shang, Shengyan;  Kunwar, Anil;  Yao, Jinye;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/02
Allocation method for transit lines considering the user equilibrium for operators 期刊论文
TRANSPORTATION RESEARCH PART C-EMERGING TECHNOLOGIES, 2019, 卷号: 105, 页码: 666-682
作者:  Yao, Baozhen;  Chen, Chao;  Zhang, Liu;  Feng, Tao;  Yu, Bin
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02
Electrochemical migration behavior of Sn-based lead-free solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 14695-14702
作者:  Qi, Xiao;  Ma, Haoran;  Wang, Chen;  Shang, Shengyan;  Li, Xiaogan
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Multicolored one-dimensional photonic crystal coatings with excellent mechanical robustness, strong substrate adhesion, and liquid and particle impalement resistance 期刊论文
JOURNAL OF MATERIALS CHEMISTRY C, 2019, 卷号: 7, 页码: 3463-3470
作者:  Niu, Wenbin;  Zhang, Lele;  Wang, Yunpeng;  Zhang, Shufen
收藏  |  浏览/下载：40/0  |  提交时间：2019/12/02

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