QQ客服 官方微博 反馈留言

	Electrochemical migration behavior of Sn-based lead-free solder
	Qi, Xiao; Ma, Haoran; Wang, Chen; Shang, Shengyan; Li, Xiaogan; Wang, Yunpeng; Ma, Haitao
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2019
卷号	30页码:14695-14702
ISSN号	0957-4522
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3229845
专题	大连理工大学
作者单位	Dalian Univ Technol, Dalian 116024, Peoples R China.
推荐引用方式 GB/T 7714	Qi, Xiao,Ma, Haoran,Wang, Chen,et al. Electrochemical migration behavior of Sn-based lead-free solder[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30:14695-14702.
APA	Qi, Xiao.,Ma, Haoran.,Wang, Chen.,Shang, Shengyan.,Li, Xiaogan.,...&Ma, Haitao.(2019).Electrochemical migration behavior of Sn-based lead-free solder.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30,14695-14702.
MLA	Qi, Xiao,et al."Electrochemical migration behavior of Sn-based lead-free solder".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30(2019):14695-14702.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。