CORC

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Simvastatin Inhibits Myocardial Apoptosis through Targeting miR-15a-5p undergoing Cardiac Surgery (CPCI-S收录) 会议
作者:  Ou, Zhi-Jun[1];  Zhou, Li[1];  Liu, Xiang[1];  Li, Yan[1];  Xu, Zhe[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Numerical Evaluation on a Direct-contact Thermal Energy Storage System (EI收录) 会议
Beijing, China,
作者:  Wang, Weilong[1];  He, Shiquan[2];  Ding, Jing[1];  Li, Hailong[3];  Yan, Jinyue[3]
收藏  |  浏览/下载:8/0  |  提交时间:2019/04/11
PHOW based feature detection for head pose estimation (EI收录) 会议
Hangzhou, China,
作者:  Jian, Wang[1];  Hua, Yan[1];  Jing, Li[2];  Ping, Xia[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/11
Study on the mechanical properties of high performance hybrid fiber reinforced cementitious composite (HFRCC) under impact loading (EI收录) 会议
Beijing, China,
作者:  Yang, Hui-Xian[1];  Li, Jing[1,2];  Huang, Yan-Sheng[1,2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Large magnetostrain in magnetic-field-aligned Mn0.965CoGe compound (CPCI-S收录) 会议
作者:  Hu, Qiu-Bo[1,2,3];  Hu, Yong[1,2];  Fang, Yong[4];  Wang, Dun-Hui[1,2];  Cao, Qing-Qi[1,2]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/11
Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices (CPCI-S收录) 会议
作者:  Ren, Kuili;  Ma, Shenglin[1];  Ma, Feilong;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载:9/0  |  提交时间:2019/04/11
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package (CPCI-S收录) 会议
作者:  Luo, Rongfeng[1];  Ren, Kuili[1];  Ma, Shenglin[1];  Yan, Jun[1];  Xia, Yanming[1]
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
Temporal and spatial variations of contaminant removal, enzyme activities, and microbial community structure in a pilot horizontal subsurface (CPCI-S收录) 会议
作者:  Yi, Xiao-Hui[1,2];  Jing, Dan-Dan[1,2];  Wan, Jinquan[1,2,3];  Ma, Yongwen[1,2,3];  Wang, Yan[1,2]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11
Process Development of Through-Glass-Via (TGV) Interposer for Radio Frequency (RF) Applications (CPCI-S收录) 会议
作者:  Yan, Jun;  Ma, Shenglin[1];  Ma, Feilong;  Xia, Yanming;  Luo, Rongfeng
收藏  |  浏览/下载:3/0  |  提交时间:2019/04/11
Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device (CPCI-S收录) 会议
作者:  Ma, Shenglin[1];  Ren, Kuili[1];  Xia, Yanming[1];  Yan, Jun[1];  Luo, Rongfeng[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/11


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