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浏览/检索结果: 共14条，第1-10条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Calculation of ampacity of single-core cables with sheath circulating current based on iterative method (EI收录) 会议论文 IET Conference Publications, Hong Kong, China, October 30, 2006 - November 2, 2006 作者:  Niu, Hai-Qing[1,2];  Shi, Yin-Xia[1,2];  Wang, Xiao-Bing[1];  Zhang, Yao[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/18 Cable sheathing  Electric power transmission networks  Iterative methods  Power transmission   A new method tor evaluating fault reduction factor in HV cable system (EI收录) 会议论文 2005 IEEE/PES Transmission and Distribution Conference and Exhibition: Asia and Pacific, Dalian, China, August 15, 2005 - August 18, 2005 作者:  Shi, Yin Xia[1];  Niu, Hai Qing[1];  Zhang, Yao[1];  Yi, Ze Pei[1];  Wang, Xiao Bing[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 Electric cables  Electric grounding  Electric power distribution  Electric substations  Short circuit currents  Signal interference  Telecommunication systems   A new method tor evaluating fault reduction factor in HV cable system (EI收录) 会议论文 Proceedings of the IEEE Power Engineering Society Transmission and Distribution Conference, Dalian, China, August 15, 2005 - August 18, 2005 作者:  Shi, Yin Xia[1];  Niu, Hai Qing[1];  Zhang, Yao[1];  Yi, Ze Pei[1];  Wang, Xiao Bing[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/18 Accident prevention  Electric cables  Electric power distribution  Electric substations  Short circuit currents  Signal interference   Study on transforming dynamic modulus master curve into static relaxation modulus master curve basing on the relaxation time spectrum of asph (EI收录) 会议论文 Applied Mechanics and Materials, Guangzhou, China, March 13, 2013 - March 14, 2013 作者:  Chi, Feng Xia[1,2];  Wang, Li Jian[3];  Zhang, Xiao Ning[4] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Asphalt mixtures  Information science  Mixtures   Study of Critical Factors Influencing the Solidification Undercooling Behavior of Sn-3.0Ag-0.5Cu (SAC) Lead-free Solder and SAC/Cu Joints (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Li, Xun-Ping[1,2];  Xia, Jian-Min[1];  Qin, Hong-Bo[1];  He, Xiao-Qi[2];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Enzymatic synthesis of naringin palmitate (EI收录) 会议论文 Advanced Materials Research, Guangzhou, China, July 13, 2012 - July 15, 2012 作者:  Zhang, Xia[1];  Li, Lin[1];  Huang, Jian-rong[2];  Chen, Ling[1];  Li, Xiao-xi[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Enzymes  Esterification  Esters  Glucose  Palmitic acid  Saturated fatty acids  Spectroscopic analysis   Synthesis and characterization of waterborne polyurethane/Cu(II)-loaded hydroxyapatite nanocomposites with antibacterial activity (EI收录) 会议论文 Journal of Nanoscience and Nanotechnology 作者:  Zhao, Cai-Xia[1,2];  Zhang, Wei-De[1];  Mai, Ai-Ping[3];  Huang, Xiao-Mo[3];  Ouyang, You-Sheng[3] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/15 Apatite  Bacteria  Escherichia coli  Hydroxyapatite  Mechanical properties  Polyurethanes  Reinforcement  Scanning electron microscopy   The Design of Embedded Control System in Knee-Joint Rehabilitation Trainer Based on S3C2440 (CPCI-S收录) 会议论文 ADVANCED MANUFACTURING SYSTEMS, PTS 1-3 作者:  Li, Xiao[1];  Zhang, Zhibin[1];  Hong, Xia[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Embedded Control System  Knee-Joint  Rehabilitation Training  S3C2440.   Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Li, Xun-Ping[1,2];  Xia, Jian-Min[1];  Qin, Hong-Bo[1];  He, Xiao-Qi[2];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Chip scale packages  Differential scanning calorimetry  Silver  Soldered joints  Soldering alloys  Solidification  Undercooling   FE Simulation of Joint Volume Effect on Fracture Behavior of BGA Structure Cu/Sn3.0Ag0.5Cu/Cu Interconnects under Lap-shear Loading (CPCI-S收录) 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Xia Jian-Min[1];  Li Xun-Ping[1];  Ma Xiao[1];  Zhang Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15