Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints (EI收录) | |
Li, Xun-Ping[1,2]; Xia, Jian-Min[1]; Qin, Hong-Bo[1]; He, Xiao-Qi[2]; Zhang, Xin-Ping[1] | |
会议名称 | ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging |
会议日期 | August 13, 2012 - August 16, 2012 |
会议地点 | Guilin, China |
关键词 | Chip scale packages Differential scanning calorimetry Silver Soldered joints Soldering alloys Solidification Undercooling |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2055926 |
专题 | 华南理工大学 |
作者单位 | 1.[1] School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China 2.[2] Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, 5th Electronics Research Institute, Ministry of Information Industry, Guangzhou 510610, China |
推荐引用方式 GB/T 7714 | Li, Xun-Ping[1,2],Xia, Jian-Min[1],Qin, Hong-Bo[1],等. Study of critical factors influencing the solidification undercooling behavior of Sn-3.0Ag-0.5Cu (SAC) lead-free solder and SAC/Cu joints (EI收录)[C]. 见:ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. Guilin, China. August 13, 2012 - August 16, 2012. |
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